뉴렌버그 동력기술 박람회 PCIM EUROPE 2024 뉴렌버그 동력기술 박람회 PCIM EUROPE 2024

1. 전시회명 : 뉴렌버그 동력기술 박람회(PCIM EUROPE 2024)

PCIM EUROPE 2024
(뉴렌버그 동력기술 박람회)

SMT CONNECT 2024
(뉴렌버그 전자어셈블리 및 시스템용 솔루션 박람회)

SENSOR+TEST 2024
(뉴렌버그 센서 및 테스트 박람회)

2. 박람회 안내

전시회명

뉴렌버그 동력기술 박람회 (PCIM EUROPE 2024)

개최기간

2024 년 6 월 11 일 ~ 6 월 13 일

전시장소

Nuremberg Exhibition Center

주 최

Mesago Messe Frankfurt GmbH https://pcim.mesago.com/events/en.html

개최규모

약 507 Exhibitors (2023년 기준)

참관객수

약 16,550 여명 참가 (2023년 기준)

전시품목

  • POWER SEMICONDUCTORS, POWER COMPONENTS, POWER MODULES AND DISCRETES
    Bipolar Transistors. Diodes. Rectifiers. Solid State Relais. IGBTs. Integrated Power Modules(IPMs). Power Modules. Discrete Devices. MOSFETs. Power System in Packange(PSiP). Thyristors. GTOs. IGCTs. Schottky Diodes. Wide Band-Gap Semiconductors(Sic. GaN. GaAs)
  • INTEGRATED CIRCUITS
    Linear ICs. Digital ICs. Coreless Transformer. Levelshifter. Application Oriented ICs(ASICs. FPGA's). Microcontrollers. MCU's. Digital Signal Processors(DSPs). Power ICs. GaN Power IC. LED Lighting Drives. Opto Semiconductor. Fiber Optics. Power Factor Correction ICs. High Voltage ICs(HV-ICs). Motion Control ICs. Communication ICs. Voltage Regulators. Gate Drivers.
  • PASSIVE COMPONENTS
    Integrated Passives. Capacitors. Supercapacitors. Electrolyte Capacitors. Foil Capacitors. Ceramic Capacitors. Chokes. Air Coils. Ferrite. EMI Filters. Power Resistors. Fuses. Current Transformers. Power Transformers. Signal Transformers. Varistors.
  • MAGNETIC MATERIALS AND COIL MATERIALS
    Magnetic Cores. Core Materials. Amorphous Magnetic Cores. Ferroelectric Ceramic Products. HF-Materials. Nanocrystalline Magnetic Cores. Permanent-Magnet Products. Powder Cores. Tape Wound Cores. SiFe Laminates. Coil Bobbins. Soft-Magnetics Products. Enamelled Copper Wire. Litz Wires.
  • THERMAL MANAGEMENT
    Heat Pipes. Ceramic Substrates. Heat Sinks. Base Plate. Lead Frame. Solder Material(Ag/Cu). Chip Gel. Peltier Elements. Phase Change Materials/Cooling. Thermal Filler Materials. Thermal Compounds. Thermal Shieldings. Thermal Insulators. Thermal Switches. Thermostats. Thermal Interface Materials. Heat Exchangers. Wafer Cooling Systems. Thermistors(NTCs. PTCs. PPTCs). Fans
  • SENSORS
    Magnetic Field Sensors. Voltage Sensors. Current Sensors. Temperature Sensors. Radiation Sensors.
  • ASSEMBLIES AND SUBSYSTEMS
    Interconnection Technologies. EMC Shielding. EMC Filters. EMC Protection. ESD Protection. Housing Technolgoies. Cables. Shielded Cables. Mounting Materials. Motor Protection Relays. Mains Filter Modules. Switches. Circuit Breakers. DC Breaker. Sockets. Connectors. Bus Bars
  • POWER CONVERTERS
    DC/DC Converter. Wireless Power Transfer. Solid-State Transformers. Frequency Converters. Rectifiers/PFC Rectifiers. High-Voltage Power Supplies. Electric Vehicles(EV) Chargers. Multilevel Converters. Multi-Phase Converters. Power Electronic Stacks. Programmable Power Supplies. Switched Mode Power Supplies(SMPS), System Power Supplies. AC Power Supplies. Power Converters for E-Mobility. Power Converters for Photovolatic. Power Converters for Railway. Power Converters for Windpower. Backup Power Systems. Uninterrruptable Power Supply. Auxiliary Power Supply
  • POWER QUALITY
    Active, single-phase main filters. Active, three-phase main filters. Passive, single-phase main filters. Passive, three-phase main filters. Lightning Protection. Mains Power Stabilizers. Voltage Stabilizers. Power Factor Correction Systems. DC-Grids. Micro-Grids
  • ENERGY STORAGE
    Energy Storage Systems. Battery Storag Systems. Smart Battery Management Systems. Battery Testers. Simulation Tools for Battery Systems. Power Manangement Systems
  • TEST EQUIPMENT and MEASUREMENT EQUIPMENT
    Current Meters. Voltage Meters. Voltage Probes. Current Probes. Multimeters. Resistance Meters. Waveform Generators. Electronic Loads. EMC and EMI Measurement ans Test Equipment. Specialized Laboratory Test Equipment. Laboratory Power Supplies. Power Analysers/Power Meters. Powerline Measurement Equipment. Oscilloscopes. Peak Current Generator. Power Cycling Testing. Wire Bonding. Later Cutting. 3D-Printer. Surge-current testing. 3D-Microscophy. Humidty-Test. Failure Aanlysis Test Equipment. Plasma Cleaning. Equipment for distructive and non-distructive Testing. Environmental Testing
  • DEVELOPMENT TOOLS AND TEST TOOLS
    Design and Development Software. Tools for Design Automation. Motor Design and Prototyping. Tools for Motor Design. Prototyping. Digital Twin. Evaluation and Demonstration Boards. Development and Testsystems(Hardware. Software. Hardware in the Loop). Software Tools for Test Systems. Simulation Software. Software for Special Applliations. Test Software
  • INFORMATION AND SERVICES
    Training. Technical Consulting Services. Technical Publishing Houses. Power Electronic Organisations and Networks


전시회명

뉴렌버그 전자어셈블리 및 시스템용 솔루션 박람회(SMTCONNECT 2024)

개최기간

2024 년 6 월 11 일 ~ 6 월 13 일

전시장소

Nuremberg Exhibition Center

주 최

Mesago Messe Frankfurt GmbH
http://www.mesago.de/en/SMT/home.html

개최규모

약 227 여개사 (2023년 기준)

참관객수

약 8,387 여명 참가 (2023년 기준)

전시품목

자동삽입기,CAE,화학원료,전자패키징,반도체생산,하이브드리드회로,인쇄회로기판(PCB),PCB생산,납땜장치,측량기,측정기술,표면실장기술(SMT),
테스팅장비,스크린프린팅,이음기술,공구류


[SYSTEM DEVELOPMENT AND PRODUCTION PREPARATION]

  • DEVELOPMENT SERVICES
    (1) CIRCUIT CONTRACT DEVELOPMENT
    ASIC design. PCB assembly design/hardware design. Software design. Designs. Circuit optimization. Design of Hybride circuits
    (2) FUNCTIONAL TEST
    Electrical simulation service. Thermal simulation service. Thermo-mechanical simulation service
    (3) AUDITS ESD Audit
  • PRODUCTION PREPARATION / PREPRODUCTION
    (1) INCOMING GOODS INSPECTION

    Light microscopes. Magnifier lamps
    (2) MARKING AND LABELING EQUIPMENT
    Labels. Label printer. Label application. Laser marking. Barcode solutions. RFID solutions
    (3) COMPONENT LOADING
    Component preparation equipment. Inertia belt reel. Heat sealing machines. Magazining units. Carrier/blister tapes
  • COMPUTER AIDED DESIGN TOOLS
    (1) DESIGN
    System design tools. Layout systems. Placing systems. CAD/CAM software. CAE/CAD tools. Components library
    (2) SIMULATION
    Electrical simulation tools, Thermal simulation tools, Thermo- mechanical simulation tools, Logic simulators, ASIC simulators
    (3) PROGRAMMING
    Programming tools, In-Circuit programmers
    (4) TEST
    Test pattern generators
  • TECHNOLOGY DEVELOPMENT, CONSULTING AND TRAINING
    (1) CONSULTING AND TRAINING
    (2) TREND ANALYSIS
    (3) PUBLISHERS
  • COMPONENTS AND MODULES
    (1) LOGIC COMPONENTS
    (2) MIXED SIGNAL COMPONENTS
    (3) POWER COMPONENTS
    (4) PASSIVE COMPONENTS
    Capacitors. Coils. Resistors. Quartz Oscillators. Fuses. Resonators
    (5) SWITCHES AND RELAYS
    Relays. Switches. Code switches. Other switches
    (6) FILM CIRCUITS
    Thickfilm devices. Thinfilm devices. Hybrid modules
    (7) INTERCONNECTION DEVICES
    Plugs. Sockets. Connectors. Contact elements, Coupler
    (8) CABLE ASSEMBLY
    Insulation stripping tools and machines. Crimping machines. Cable assembly machines. Cable harness sheating machines. Cable marking systems
    (9) CABLE HARDNESS ASSEMBLY
    Cable confection service. Cable hardness sheating service. Cable marking systems. Crimp services
    (10) LED AND DISPLAYS
    Display systems. LC Displays and modules. Plasma displays. Touch screen systems. Other displays
    (11) BATTERIES AND HOLDERS
    (12) Key boards and input devices
    (13) Dummy components
    (14) Housing

    Enclosures for electronics. Sensor packages. Housing for microsystems. Thermal management packages. Hybrid housing. Ceramic packagings. Metal top cover. Ball grid arrays. PAL. PLD. FPGA. Pin-Grid arrays
  • MATERIALS AND COMPONENTS FOR THERMAL MANAGEMENT
    Thermal interface materials. Cooler. Fan / Ventilator. Other components
  • CIRCUIT CARRIERS AND PROCESSING EQUIPMENT
    (1) CERAMIC CIRCUIT CARRIERS
    Ceramic substrates and circuits. LTCC tape materials and circuits.
    Direct bonded copper substrates
    (2) FR4 circuit carriers
    Resins. Laminates. Single and multilayer substrates. PCB with embedded components. Thick copper PCB. Heatsink PCB
    (3) FLEXIBLE CIRCUIT CARRIERS
    (4) 3D CIRCUIT CARRIERS
    3D MID
    (5) CIRCUIT CARRIER FOR SPECIAL PURPOSES
    High temperature circuit carriers. High frequency circuit carriers. High current circuit carriers. High Density Interconnect Circuit Carriers. Optical/electro-optical circuit boards
    (6) OTHER SUBSTRATES
    Alumnium circuit carriers. IMS substrates. Copper laminated metal substrates. Photo-sensitive substrates
  • MATERIAL TESTING
    Hardness measurement devices. Viscosimeter. Microscope. Humidity. Wetting. Electrical resistance
  • MANUFACTURING EQUIPMENT FOR COMPONENTS AND MODULES
    (1) PRINTING

    - TEMPLATE AND SCREEN PRINT
    Template and screen printers. Templates and screens. Sweegees. Screen and template print equipment. Screen and Soldering frame cleaner. Self-mounting systems. Thick film inks. Soldering pastes. Adhesives
    - DISPENSING AND MIXING
    Dispensing machines. Dispensing accessories
    - ENCAPSULANTS
    Globtop materials. Potting materials. Underfiller
    - CONFORMAL COATING
    Conformal coating systems. Conformal coatings
    - JETTING
    Ink jetter. Paste jetter. Solderpaste jetter
    (2) ADHESIVE BONDING
    Adhesives. SMD adhesives. Conductive adhesives. Die attach adhesives
    (3) PLACEMENT MACHINES AND ASSEMBLY STATIONS
    Manual/semiautomatic SMT-insertion machines. Fully automatic SMT-insertion machines. 3D assembly equipment. Positioning systems. Special assembly stations. Assembly tools and benches
    (4) SOLDERING
    Reflow soldering systems. Vapor-phase soldering systems. Wave soldering systems. IR soldering systems. Laser soldering systems. Selective soldering systems. Special soldering systems(Pulse soldering systems. Induction soldering systems. Spot soldering systems). Soldering irons(Hot-ba soldering systems. Light-beam soldering systems. Nitrogen hand-soldering stations. Wave hand-soldering systems. Hot-air soldering systems). Soldering materials(Solders. Soldering pastes. Solder preforms. Solder wires. Solder spheres). Fluxes. Soldering auxiliary equipment(Soldering masks. Soldering frames. Solder wire feeder). Solder recovery. Solder analysis
    (5) HARDENING
    UV-Hardening. IR-Hardening. Thermal hardening. Vacuum ovens. Hotplates
    (6) BONDING
    - Die bonders
    - Wire bonders(Wire bonding machines. Wire bonding tools. Bond wires. Ultrasonic generators. Ultrasonic transducer systems)
    (7) MECHANICAL CONNECTION TECHNOLOGY
    Clamping. Plugging. Crimping
    (8) MANUAL WORKSTATIONS
    BGA/SMT reworksystems. PCB track control and repair stations
    (9) BALLING
    Manua/semiautomatic balling systems. Fully automatic balling systems
  • MANUFACTURING SUPPORTING EQUIPMENT
    (1) AUTOMATION AND HANDLING EQUIPMENT
    Component loading equipment. Handling systems for chips. Handling and automatic feed. Machine linking and transport. Storage devices. Drives(Direct drives. Linear motors. Linear actuators).
    (2) CLEANROOM TECHNOLOGIES
    Clean room Equipment. Clean room Materials. Flow boxes
    (3) WORKPLACE FURNITURE
    Assembly benches, Magnifiers, Lamps.
    (4) ESD-PROTECTION
    Anti-static work places. ESD-clothing. ESD-packaging, storage and shipping
    (5) STORAGE
    Dry storage systems. Storage systems under nitrogen atmosphere. Vacuum storage sytems. Cooling cabinets. Heating cabinets
    (6) MAGAZINES AND CONTAINERS
    Plastic magazines and containers. Metal magazines and containers. Vacuum boxes
    (7) PACKAGING
    Carrier/blister tapes. Packaging material. Desiccants. Humidity indicator cards
    (8) CLEANSER
    stencil cleaners. PCB cleaners. Plastic cleaners
    (9) CLEANING AND RECYCLING SYSTEMS
    Plasma cleaning systems. Dry ice jet cleaner. Other cleaning devices. Waste water recycling equipment. Nobel metal recycling equipment. Filtration apparatus. Ionization devices
    (10) ENVIRONMENT AND OCCUPATIONAL SAFETY
    Solder recovery. Exhaust systems. Solder vapour extraction systems. Filters. Solder fume exhaust systems. Gas purification and flux condensing units. Fan/ventilator
  • MANUFACTURING SERVICES
    (1) ELECTRONIC MANUFACTURING SERVICES (EMS)
    Assembly. Surface pretreatment. Plating of Substrates
    (2) PCB MANUFACTURING Photo plotter service
    (3) COMPONENTS PROVISION
    Taping and reeling. SMD Taping. Cutting. bending. forming. Sorting.
    (4) WAFER LEVEL PACKAGING
    Wafer thinning. Wafer level redistribution. Wafer bumping. Chip size packaging (CSP). Semiconductor interconnections. Semiconductor housing
    (5) CHIP ON BOARD-ASSEMBLY
    Chip on flex assembly. Flip chip assembly. Chip on glas assembly.
    (6) FILM CIRCUITS
    Thick film hybrids. Thin film circuits
    (7) LASER MACHINING
    Laser drilling. Laser cutting. Laser trimming
    (8) ENCAPSULATION
    Molding. Potting. Glob top. Dam & Fill. Hermetic packaging
    (9) ASSEMBLY INSPECTION AND TESTING
    Test houses. AOI Service. AXI Service. Test program development.
    (10) QUALITY ASSURANCE AND ANALYSIS
    Release testing, Reliability consulting .Failure analysis. Calibration services
  • TEST EQUIPMENT FOR ASSEMBLIES
    (1) OPTICAL INSPECTION STATIONS
    Automatic optical inspection(AOI)(Solder paste AOI. Assembly AOI). Manual optical inspection(Magnifier lamps. Microscopes). PCB inspection systems. Surface measuring system(Laser profilometer. Roughness measurement systems. Flatness measurement systems). Film Thickness measuring device
    (2) ELECTRICAL INSPECTION
    Component test equipment. Probe card analyzer. probes. probe cards. PCB test equipment. Assembly test equipment. In-circuit test equipment and programs. Flying probe test equipment. Function test equipment. Insulation test equipment. EMC test equipment. High frequency measurement equipment. Hot tes for PCB and hybrids. Test programs. Other test and balance systems
    (3) X-RAY INSPECTION
    Computer tomography(CT), Automatic X-ray inspection(AXI). Manual X-ray inspection(MXI)
    (4) ULTRASONIC SOUND INSPECTION
    Transducter test systems. Acustic microscopes
    (5) MECHANICAL INSPECTION
    Bonding testers. Adhesion testers
    (6) CHEMICAL INSPECTION
    Contaminometers. Hygrometer. Oxygen analyzers. Other analytical / diagnostical equipment,
    (7) OTHER INSPECTION SYSTEMS
    Sonar test equipment. Leakage testers
    (8) EQUIPMENT ACCESSORIES FOR ASSEMBLY INSPECTION

    Test pins. Grinding machines
  • PROCESS AND EQUIPMENT TESTING
    (1) PROCESS AND EQUIPMENT TESTING
    Optical displacement measurement systems. Optical amplitude measurement systems for wirebonder. Bondability tester. Adhesion testers. Screen tension measuring devices. Solderability testers. Soldering machines Control equipment. Temperature profiler, Training and testkids
    (2) MES-SYSTEM
    Production data acquisition systems. Machine data acquisition systems.


전시회명

뉴렌버그 센서, 테스트 및 계측 박람회(SENSOR+TEST 2024)

개최기간

2024 년 6 월 11 일 ~ 6 월 13 일

전시장소

Nuremberg Exhibition Center

주 최

AMA Service GmbH http://www.sensor-test.de

개최규모

약 338 Eexhibitors (2023년 기준)

참관객수

약 5,138 여명 참가(2023년 기준)

전시품목

[SENSORS]

  • SENSORS and SENSING ELEMENTS by MEASURED PARAMETER
    Geometric parameters. Mechanical parameters. Dynamic parameters. Thermal and caloric parameters. Atmospheric and meteorological parameters. Optical parameters. Acoustic parameters. Electrical parameters. Chemical, biological and medical parameters. Gas sensors. gas concentration. Further measured parameters.
  • SENSORS AND SENSING ELEMENTS by MEASUREMENT PRINCIPLE
    Strain guages, Semiconductor strain gauges, piezoresistive. Resistive sensor element. Piezoresistive sensing element. Thin-film measuring cell. Thick-film measuring cell. Thermoresistor. Measuring potentiometer. Inductive sensor element. Capacitive sensor element. Piezoelectric Sensor Element. Magneto-resistive Sensing Element. Magnetostrictive sensor element. Hall sensing element. Hall angle sensor. Hall switch. Hall IC. Light barrier. Light curtain. Pyroelectric sensing element. Thermocouple. Thermocouple equalization lead. Photo cell. Photo Sensor. Fibre-optic sensor. Optoelectronic element. Optical interferometer or interference sensing element. UV measuring cell. Infrared, IR measuring cell. Laser measuring cell. Radar measuring cell. Ultrasound measuring cell. Solid state electrolyte. Semiconductor gas sensing element. Semiconductor temperature sensing element. ISFET sensor element. Laminar flow element. Tehrmopile. Organic semiconductor sensor. Emitter receiver array. CCD System. COMS System. Microswitch. Electro-optical rotary encoder. Electrochemical gas sensor. Heat tone sensor. SAW sensor. Ion-selective electrode. Further sensors and sensing elements. Nondispersive infrared sensor.
  • SENSOR COMPONENTS AND ACCESSORIES
    Special material. Semi-finished part for sensors. Wafer, polished. Ceramic raw material. Ceramic component. Piezo ceramic. Thickfilm paste. Special glass. Protective coating. Casting compond, resin, synthetic. Permanent magnet. Ultrasonic generator. Light Source. Illuminating system. LED. Laser System. Optical Component. Lens optics. Diffractive Optics. Fresnel optics. Foil optics. Optical mirror. Reflector. Optical fibre cable. Electrical feedthrough. ASIC. Sensor specific. Sensor interface IC. Hybrid circuit. Interface module. Communication module, wireless. LCD. Mechanical process interface. Hermetically sealed Housing. Connector. PCB. Turned part. Power supply. Cable. Function Test station. Evaluation tool. Acoustic wave component. Thermometer protection tube. Gasket. Seal. Actuators. Sample gas doser. Polarizer. Further sensor components and accessories.
  • EQUIPMENT for THE PRODUCTION OF SENSORS AND ACTUATORS
    Exposure Equipment. Equipment for photolithography. Dosing device. Diffusion tube. Coating systems. Coating system. Laser Scoring, cutting and trimming system. Cleaning equipment. Etching equipment. Wafer saw. Equipment for desiccation, drying. Bonding equipment. Resistance soldering. welding equipment. Lettering equipment. Clean-room equipment. Flow box. ESD Equipment. Laser Welding system.


[MEASUREMENT TECHNOLOGY]

  • TELEMETRY SYSTEM AND COMPONENTS
  • MODELING AND SIMULATION, HiL
  • MEASURING EQUIPMENT
    Multimeter. Oscilloscope. Signal generator. Transient recorder. Data logger and radio transmitter. Modular universal measuring instrument. Combined measurement and control device. PC-based measurement system. Force-dis-placement measuring equipment. Power meter. Portable measuring instrument for industrial sensors. Stroboscope. Strobe Light. Tachometer. Further measuring equipment. Signal analyzers. Gas system threshold monitor. Thermal imaging Camera.
  • MEASURING EQUIPMENT WITH INTEGRATED SENSOR
    Geometric parameter. Mechanical parameter. Dynamic parameter. Thermal and caloric parameter. Atmospheric and meteorological parameter. Optical parameter. Acoustic parameter. Electrical parameter. Chemical, biological, medical parameter. Gas concentration. Image processing parameter. Electron spectrometer. Optical spectrometer. Multi gas(Ox, Tox, Ex). Photoacoustic spectrometer, PAS. Further measuring equipment with integrated sensor. Vibration measuring device. 
  • MEASUREMENT MODULES. MEASUREMENT DATA ACQUISITION SYSTEMS
    Analog Signals. Digital Signals. Bus Systems. Communication systems and protocols. Measurement systems with integrated signal conditioning.
  • SOFTWARE
    Parametrization. Visualization. Signal Analysis. Signal Evaluation. Statistics. Database. System integration software. Programming environment. Automation software. Data Acquisition. Measurement value acquisition. Vibration analysis. Audio and Video Integration. Cloud Server Service. Thermography software
  • MEASUREMENT COMPONENTS AND ACCESSORIES
    Bus system and interface. Cables. Connectors. Accessories for digital signal transmission. Wireless signal transmission. Optical Signal transmission. Signal filter. Multiplexer. AD/DA Converter. Control component. Controller. Data Storage. Power Supply Voltage. Universal display unit or operator panel. Normal. Calibrator and Calibrator accessories. Paperless recorder. Electronic general. Data Acquisition card. Measurement Amplifier
  • lMAGE PROCESSING
  • TESTING TECHNOLOGY


[SERVICES]

  • Research and Development. R&D. Knowledge Transfer
  • Contract manufacture. Production
  • Calibration and Testing
  • General Contracting services

3. 박람회 참관안내

구분

참관기간

항공

참관경비

일정

제1안

6.10~14

대한항공

별도문의

제2안

6.10~14

아시아나

별도문의

제3안

6.10~14

독일항공

별도문의

* 독일항공 탑승시 아시아나항공 마일리지 누적 가능

포함

내역

왕복항공료. 1급 호텔 (2인1실 기준). 2억원 여행자 보험. 호텔 조식. 인천공항 이용료. 출국납부금. 현지공항세
유류할증료 ★ 전시입장료 (사전등록시 86유로, VAT 19%별도)

불포함

전시장내의 중식 및 석식. 전용 차량 및 가이드
여권유효기간이 6개월 이상 남아있어야 합니다.

이용호텔

HOLIDAY INN EXPRESS FUERTH (1급호텔)

2023년 1분기 신축 오픈

뉴렌버그 공항까지 차로 23분거리
Stadthalle U-Bahn 역까지 걸어서 4분 거리
전시장까지 U-Bahn 이동시 30분 소요 (직행 - 19개 정류장)
무료 WiFi 사용가능

ADD : Rosenstr 44, Fuerth, 90762
TEL : 49-911-8170590

4. 참관신청방법

신청방법

아래의 참관신청서를 작성후 icetour@icetour.co.kr로 신청하여 주십시오.

-
신청금은 아래계좌로 입금하여 주시고, 잔액은 출발 1주일 전까지 완불하여 주시면 됩니다
하나은행 374-810031-68904 예금주 : (주)국제박람회여행사
[취소시] 인보이스 참조

신청서 양식

최저
행사인원

10명
최저 행사 인원이 안될 경우 엑스포텔(EXPOTEL) 상품으로 진행합니다.

상담 및 문의

Tel: 02-585-1009
김소정 실장. 안아림 팀장
(icetour@icetour.co.kr)

기타 사항

단체 행사 (10인 이상), 기업연수, 업체 방문 수배, 개별 출장 등 문의 하여 주시면 최고의 컨설팅으로 최상의 일정을 준비하여 드리겠습니다.

5. 박람회 참관 일정표

제1안 대한항공(KE) 박람회 3일 참관 (기차이동)

일자

지역

교통편

시간

세부일정

식사

제1일
6/10
(월)

인천
프랑크푸르트
뉴렌버그


KE945

기차

개별이동

07:50
10:50 17:40
20:35
23:00

인천공항 제2터미널 대한항공 카운터 수속
인천 출발
프랑크푸르트 도착
프랑크푸르트 공항역 출발
뉴렌버그 중앙역 도착
호텔 개별 CHECK-IN

기내식
X

제2일
6/11
(화)

뉴렌버그

개별이동

전일

호텔 조식 후
뉴렌버그 PCIM, SMT, 센서 박람회 참관
호텔 투숙

호텔식
X
X

제3일
6/12
(수)

뉴렌버그

개별이동

전일

호텔 조식 후
뉴렌버그 PCIM, SMT, 센서 박람회 참관
호텔 투숙

호텔식
X
X

제4일
6/13
(목)

뉴렌버그
프랑크푸르트


개별이동
기차

KE946



13:57
16:20
19:40

호텔 조식 후 CHECK-OUT
뉴렌버그 PCIM, SMT, 센서 박람회 참관
뉴렌버그 중앙역 출발
프랑크푸르트 공항역 도착
프랑크푸르트 출발

호텔식
X
기내식

제5일
6/14
(금)

인천

14:35

인천 도착 후 해산

호텔 : HOLIDAY INN EXPRESS FUERTH (1급호텔)
상기 일정은 항공편 및 현지사정에 의하여 변경될 수 있습니다.

제2안 아시아나(OZ) 박람회 3일 참관 (기차이동)

일자

지역

교통편

시간

세부일정

식사

제1일
6/10
(월)

인천
프랑크푸르트
뉴렌버그


OZ541

기차

개별이동

06:45
09:45 16:30
19:34
21:57

인천공항 제1터미널 아시아나 카운터 수속
인천 출발
프랑크푸르트 도착
프랑크푸르트 공항역 출발
뉴렌버그 중앙역 도착
호텔 개별 CHECK-IN

기내식
X

제2일
6/11
(화)

뉴렌버그

개별이동

전일

호텔 조식 후
뉴렌버그 PCIM, SMT, 센서 박람회 참관
호텔 투숙

호텔식
X
X

제3일
6/12
(수)

뉴렌버그

개별이동

전일

호텔 조식 후
뉴렌버그 PCIM, SMT, 센서 박람회 참관
호텔 투숙

호텔식
X
X

제4일
6/13
(목)

뉴렌버그
프랑크푸르트


개별이동
기차

OZ542



12:57
15:20
18:30

호텔 조식 후 CHECK-OUT
뉴렌버그 PCIM, SMT, 센서 박람회 참관
뉴렌버그 중앙역 출발
프랑크푸르트 공항역 도착
프랑크푸르트 출발

호텔식
X
기내식

제5일
6/14
(금)

인천

13:20

인천 도착 후 해산

▶ 호텔 : HOLIDAY INN EXPRESS FUERTH (1급호텔)
상기 일정은 항공편 및 현지사정에 의하여 변경될 수 있습니다.

제3안 독일항공(LH) 박람회 2일 참관 (항공이동) ;아시아나 마일리지 적립가능

일자

지역

교통편

시간

세부일정

식사

제1일
6/10
(월)

인천
프랑크푸르트
뉴렌버그


LH713

LH150

개별이동

09:25 12:25 18:40
22:15
22:55

인천공항 제1터미널 루프트한자 카운터 수속
인천 출발
프랑크푸르트 도착
프랑크푸르트 출발
뉴렌버그 도착
호텔 CHECK-IN

기내식
X

제2일
6/11
(화)

뉴렌버그

개별이동

전일

호텔 조식 후
뉴렌버그 PCIM, SMT, 센서 박람회 참관
석식 후 호텔 투숙

호텔식
X
X

제3일
6/12
(수)

뉴렌버그

개별이동

전일

호텔 조식 후
뉴렌버그 PCIM, SMT, 센서 박람회 참관
석식 후 호텔 투숙

호텔식
X
X

제4일
6/13
(목)

뉴렌버그
프랑크푸르트


LH147

LH712


11:15
12:05
15:25

호텔 조식 후 CHECK-OUT

뉴렌버그 출발
프랑크푸르트 도착
프랑크푸르트 출발

호텔식
X
기내식

제5일
6/14
(금)

인천

09:55

인천 도착 후 해산

▶ 호텔 : HOLIDAY INN EXPRESS FUERTH (1급호텔)
상기 일정은 항공편 및 현지사정에 의하여 변경될 수 있습니다.

 

 

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