PCIM EUROPE 2025
(뉴렌버그 동력기술 박람회)

SENSOR+TEST 2025
(뉴렌버그 센서, 테스트 및 계측 박람회)

전시회명

뉴렌버그 동력기술 박람회 (PCIM EUROPE 2025)

개최기간

2025 년 5 월 6 일 ~ 5 월 8 일

전시장소

Nuremberg Exhibition Center

주 최

Mesago Messe Frankfurt GmbH
https://pcim.mesago.com/events/en.html

개최규모

약 637 Exhibitors (2024년 기준)

참관객수

약 18,102 여명 참가 (2024년 기준)

전시품목

• Power Semiconductors, Power Components, Power Modules and Discretes
  Bipolar Transistors. Diodes. Rectifiers. Solid State Relais. IGBTs. Integrated Power Modules(IPMs). Power Modules. Discrete Devices. MOSFETs. Power Electronic Building Block(PEBB). Power System in Package(PSiP). Smart Power System Integration. Thyristors. GTOs. IGCTs. Schottky Diodes. Wide Band-Gap Semiconductors(Sic. GaN. GaAs).
• Integrated Circuits
  Linear ICs. Digital ICs. Coreless Transformer. Levelshifter. Application Oriented ICs(ASICs. FPGA's). Microcontrollers. MCU's. Digital Signal Processors(DSPs). Power ICs. GaN Power IC. LED Lighting Drives. Opto Semiconductor. Fiber Optics. Power Factor Correction ICs. High Voltage ICs(HV-ICs). Motion Control ICs. Communication ICs. Voltage Regulators. Gate Drivers.
• Passive Components
  Integrated Passives. Capacitors. Supercapacitors. Electrolyte Capacitors. Foil Capacitors. Ceramic Capacitors. Chokes. Air Coils. Ferrite. EMI Filters. Power Resistors. Fuses. Current Transformers. Power Transformers. Signal Transformers. Varistors.
• Magnetic Materials and Coil Materials
  Magnetic Cores. Core Materials. Amorphous Magnetic Cores. Ferroelectric Ceramic Products. HF-Materials. Nanocrystalline Magnetic Cores. Permanent-Magnet Products. Powder Cores. Tape Wound Cores. SiFe Laminates. Coil Bobbins. Soft-Magnetics Products. Enamelled Copper Wire. Litz Wires.
• Thermal Management
  Heat Pipes. Ceramic Substrates. Heat Sinks. Base Plate. Lead Frame. Solder Material. Solder Material(Ag/Cu). Chip Gel. Peltier Elements. Phase Change Materials/Cooling. Thermal Filler Materials. Thermal Compounds. Thermal Shieldings. Thermal Insulators. Thermal Switches. Thermostats. Thermal Interface Materials. Heat Exchangers. Wafer Cooling Systems. Thermistors(NTCs. PTCs. PPTCs). Fans.
• Sensors
  Magnetic Field Sensors. Voltage Sensors. Current Sensors. Temperature Sensors. Radiation Sensors.
• Assemblies and Subsystems
  Interconnection Technologies. EMC Shielding. EMC Filters. EMC Protection. ESD Protection. Housing Technolgoies. Cables. Shielded Cables. Mounting Materials. Motor Protection Relays. Mains Filter Modules. Switches. Circuit Breakers. DC Breaker. Sockets. Connectors. Bus Bars.
• Power Converters
  DC/DC Converter. Wireless Power Transfer. Solid-State Transformers. Frequency Converters. Rectifiers/PFC Rectifiers. High-Voltage Power Supplies. Electric Vehicles(EV) Chargers. Multilevel Converters. Multi-Phase Converters. Power Electronic Stacks. Programmable Power Supplies. Switched Mode Power Supplies(SMPS), System Power Supplies. AC Power Supplies. Power Converters for E-Mobility. Power Converters for Photovolatic. Power Converters for Railway. Power Converters for Windpower. Backup Power Systems. Uninterrruptable Power Supply. Auxiliary Power Supply.
• Power Quality
  Active, single-phase main filters. Active, three-phase main filters. Passive, single-phase main filters. Passive, three-phase main filters. Lightning Protection. Mains Power Stabilizers. Voltage Stabilizers. Power Factor Correction Systems. DC-Grids. Micro-Grids.
• Energy Storage
  Energy Storage Systems. Battery Storag Systems. Smart Battery Management Systems. Battery Testers. Simulation Tools for Battery Systems. Power Manangement Systems.
• Test Equipment and Measurement Equipment
  Current Meters. Voltage Meters. Voltage Probes. Current Probes. Multimeters. Resistance Meters. Waveform Generators. Electronic Loads. EMC and EMI Measurement ans Test Equipment. Specialized Laboratory Test Equipment. Laboratory Power Supplies. Power Analysers/Power Meters. Powerline Measurement Equipment. Oscilloscopes. Peak Current Generator. Power Cycling Testing. Temperatur Cycling Testing. Wire Bonding. Laser Cutting. 3D-Printer. Surge-current Testing. 3D-Microscophy. Humidty-Test. Failure Aanlysis Test Equipment. Plasma Cleaning. Equipment for distructive and non-distructive Testing. Environmental Testing.
• Development Tools and Test Tools
  Design and Development Software. Tools for Design Automation. Motor Design and Prototyping. Tools for Motor Design. Prototyping. Digital Twin. Evaluation and Demonstration Boards. Development and Testsystems(Hardware. Software. Hardware in the Loop). Software Tools for Test Systems. Simulation Software. Software for Special Applliations. Test Software.
• Information and Services
  Training. Technical Consulting Services. Technical Publishing Houses. Power Electronic Organisations and Networks.

전시회명

뉴렌버그 센서, 테스트 및 계측 박람회 (SENSOR+TEST 2025)

개최기간

2025 년 5 월 6 일 ~ 5 월 8 일

전시장소

Nuremberg Exhibition Center

주 최

AMA Service GmbH
http://www.sensor-test.de

개최규모

약 338 Exhibitors (2024년 기준)

참관객수

약 4,967 여명 참가 (2024년 기준)

전시품목

[SENSORS]

• Sensors and Sensing Elements by Measured Parameter
  Geometric parameters. Mechanical parameters. Dynamic parameters. Thermal and caloric parameters. Atmospheric and meteorological parameters. Optical parameters. Acoustic parameters. Electrical parameters. Chemical, biological and medical parameters. Gas sensors. gas concentration. Further measured parameters.
• Sensors and Sensing Elements by Measurement Principle
  Strain guage, Semiconductor strain gauges, piezoresistive. Resistive sensor element. Piezoresistive sensing element. Thin film measuring cell. Thick film measuring cell. Thermoresistor. Measurement potentiometer. Inductive sensing element. Capacitive sensing element. Piezoelectric sensing element. Magneto-resistive sensing element. Magnetostrictive sensor element. Hall sensing element. Hall angle sensor. Hall switch. Hall IC. Light barrier. Light curtain. Pyroelectric sensing element. Thermocouple. Thermocouple equalization lead. Photo cell. Photo sensor. Fibre-optic sensor. Optoelectronic element. Optical interferometer or interference sensing element. UV measuring cell. Infrared, IR measuring cell. Laser measuring cell. Radar measuring cell. Ultrasound measuring cell. Solid state electrolyte. Semiconductor gas sensing element. Semiconductor temperature sensing element. ISFET sensor element. Laminar flow element. Tehrmopile. Organic semiconductor sensor. Emitter receiver array. CCD system. CMOS system. Microswitch. Electro-optical rotary encoder. Electrochemical gas sensor. Heat tone sensor. SAW sensor. Ion-selective electrode. Further sensors and sensing elements.

• Sensor Components and Accessories
  Special material. Semi-finished part for sensors. Wafer, polished. Ceramic raw material. Ceramic component. Piezo ceramic. Thickfilm paste. Special glass. Protective coating. Casting compond, resin, synthetic. Permanent magnet. Ultrasonic generator. Light Source. Illumination system. LED. Laser System. Optical component. Lens optics. diffractive optics. Fresnel optics. foil optics. Optical mirror. reflector. Optical fibre cable. Electrical feedthrough. ASIC. sensor- specific. Sensor interface IC. Hybrid circuit. Interface module. Communication module, wire-bound. Communication module, wireless. LCD. Mechanical process interface. Hermetically sealed housing. Connector. PCB. Turned part. Power supply. Power supply for wireless sensors. Cable(copper cable). Function test station. Evaluation tool. Acoustic wave component. Thermometer protection tube. Sample gas doser. Polarizer. Gasket. seal. Further sensor components and accessories. Actuators.
• Equipment for The Production of Sensors and Actuators
  Exposure equipment. Equipment for photolithography. Dosing device. Diffusion tube. Coating systems, e.g. thermal coater. Coating system. Laser scoring, cutting and trimming system. Cleaning equipment. Etching equipment. Wafer saw. Equipment for desiccation, drying; tunnel furnace. Bonding equipment. Resistance soldering/welding equipment. Lettering equipment. Clean-room equipment. Flow box. ESD Equipment. Laser Welding system. Micromounting system. Further equipment for the production of sensors and actuators.

[MEASUREMENT TECHNOLOGY]

• Telemetry System and Components
• Modeling and Simulation, Hil
• Measuring Equipment
  Multimeter. Oscilloscope. Signal generator. Transient recorder. Data logger and radio transmitter. Modular universal measuring instrument. Combined measurement and control device. PC-based measurement system. Force-displacement measuring equipment. Power meter. Portable measuring instrument for industrial sensors. Stroboscope, strobe light. Tachometer. Gas system threshold monitor. Thermal imaging camera. Signal analyzers. Further measuring equipment.
• Measuring Equipment with Integrated Sensor
  Geometric parameter. Mechanical parameter. Dynamic parameter. Thermal and caloric parameter. Atmospheric and meteorological parameter. Optical parameter. Acoustic parameter. Electrical parameter. Chemical, biological, medical parameter. Gas concentration. Image processing parameter. Electron spectrometer. Optical spectrometer. Multi gas(Ox, Tox, Ex). Photoacoustic spectrometer, PAS. Vibration measuring device. Further measuring equipment with integrated sensor.  
• Measurement Modules. Measurement Data Acquisition Systems
  Analog signals. Digital signals. Bus systems. communication systems and protocols. Measurement systems with integrated signal conditioning.
• Software
  Parametrization, visualization. Signal Analysis, signal Evaluation. Simulation. Statistics. Database. System integration software. Programming environment. Automation software. Data acquisition. measurement value acquisition. Vibration analysis. Audio and video integration. Cloud Server Service. Calibration software. Thermography software. Further measurement software.
• Measurement Components and Accessories
  Electronics general. Data acquisition card. Bus system and interface. Cables, connectors, accessories for digital signal transmission. Wireless signal transmission(WLAN. UMTS. telemetry. Bluetooth, etc.). Optical Signal transmission(fiber optic). Signal filter. Multiplexer. Measurement amplifier. AD/DA converter. Control component(SPS. PLC. DIO. etc.). Controller. Data Storage. Power Supply Voltage, power supply current. Universal display unit or operator panel. Normal. Calibrator and calibrator accessories. Paperless recorder. Further measurement components and accessories.
• lmage Processing
  Image processing, general. Identity, code recognition. Object detection, object comparison. Object presence, object absence. Object measurement. Pattern recognition, pattern comparison. Spectral image processing. Motion detection. Free distance detection. Landmark detection/identification. Perspective positioning. 2D-/3D-Figure analysis. Barcode reader. 2D code, 2D barcode. Line camera. Compact vision system. Infrared system. DNA microarray. Further image processing parameters
• Testing Equipment
  Automotive testing systems. Testing systems for aerospace. Testing systems for electronics and electrical engineering. Testing systems for further industries and applications. Material testing. Non-destructive material and component testing

[SERVICES]

• Research and Development. R&D and knowledge transfer
  General IT. software. hardware services. Development. characterization and optimization. Modeling and simulation. System integration
• Contract manufacture. Production
  Strain gauge technology. Thick film technology. Thin film technology. Semiconductor technology. LIGA technology. CMOS technology. Ceramin technology. Plastics technology. Fiber optics. Precision mechanics. Microsystems technology MST/Micro-Electro-Mechanical-Systems MEMS.Microsensor technology. Microactuator technology. Microfluidics, microstructuring. Integrated optics, microoptics. Microelectronics. Hybrid technology. Additive manufacturing(3D printing). Mechatronics. Adaptronics. Bus systems. ASIC. Contract manufacture. Laser processing. Etching technology. Galvanic processing. Bonding. Micro drilling. Micro welding. Micro gluing. Micro cutting. Molding-, micro molding technology. Housing production. Connector, cable technologies. Peripherals technology. Unit contract manufacture. Cleaning/Activating. Other services concerning sensor systems and actuators. Actuator-specific. Prototype manufacture. Electronics manufacturing service, EMS. Electron beam welding. Chemical sensors. Liquid seal. Electron beam lithography. Photo lithography and embossing. Semiconductor processing. Multilayer coating. Additive manufacturing(3D Printing). Parylene conformal coating. Injection molding. Chemical, electroless metallization. 3D structural electronics production. Printing. Further contract manufacture, production.
• Calibration and Testing
  Accredited calibration laboratory. Testing and calibration services.

• General contracting services
  Measuring service. Rental of measuring equipment. Automation system design. Service/maintenace. Training, continued education. Training-on-the-project. Publishing service, journal, literature. Exhibition and trade fair services. Consulting in Micro Systems Technologies, MEMS. Engineering services. Project planning. Business consulting. Consulting for marketing, advertisement, public relaitions, sales. Technology consulting. Consultance in financial-support programmes. Subsidy and funding consulting. Standards, norms. Repairs. Representation of interests. Studies and expert reports. Microelectronics consulting. Further general contracting services.

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