동경 화상 박람회 IMAGING JAPAN 2023
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전시회명 :
동경 화상 박람회 (IMAGING JAPAN 2023)
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Imaging
Japan 2023
(동경 화상
박람회)
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InterOpto 2023
(동경
광전자 박람회)
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Smart
Sensing 2023
(동경
스마트센싱 박람회)
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Total
Organic Devices Expo 2023
(동경
IoT 지원반도체 및 회로기판 박람회)
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WIRE
Japan Show 2023
(동경
와이어
및 케이블 박람회)
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Jisso
PROTEC 2023
(동경
실장
프로세스 테크놀러지 박람회)
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Microelectronics Show 2023
(동경
최첨단 전자
기술 박람회)
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JPCA
SHOW
2023
(동경
전자회로산업 박람회)
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SDGS 2023
(동경 SDGS 박람회)
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전시회명 |
동경
화상 박람회(IMAGING JAPAN) |
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개최기간 |
2023
년 5 월 31 일 ~ 6 월 2 일 |
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전시장소 |
Big Sight |
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주
최
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http://www.jpcashow.com/show2023/en/
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전시품목 |
Various
kinds of image sensors. cameras. image processing systems.
image recognition. Deep Learning. Micro vision. Display.
VR/AR. LiDAR
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전시회명 |
동경 광전자
박람회
(INTEROPTO) |
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개최기간 |
2023
년 5 월 31 일 ~ 6 월 2 일 |
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전시장소 |
Big Sight |
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전시품목 |
- Laser. Light Sources(semiconductors,
fiber)
- Optical Devices
- Modules(Lenses.
Filters. Mirrors. Scanner)
- Optical Equipment
- Instruments
- Industry-concerned
Equipment(Opto-laboratory equipement. Devices)
- Services
- Software. Design.
5G
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전시회명 |
동경 스마트센싱
박람회
(SMART
SENSING 2023) |
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개최기간 |
2023
년 5 월 31 일 ~ 6 월 2 일 |
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전시장소 |
Big Sight |
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전시품목 |
Sensors, Sensor Nodes, Semiconductors, Parts and Devices, Electronics, Telecommunications Devices, Network Systems, Software, Data Platform, Power Sources, Other Related Devices,Technologies and Services
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전시회명 |
동경
와이어 및 케이블 박람회 (WIRE Japan Show 2023)
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개최기간 |
2023
년 5 월 31 일 ~ 6 월 2 일 |
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전시장소 |
Big Sight |
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주
최 |
Japan Electronics Packaging and Circuits Association(JPCA) |
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개최규모 |
약 507
Exhibitors (2019년
기준)
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참관객수 |
약 44,110
여명 참가 (2019년 기준)
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전시품목 |
- Industrial equipment and communications, such as electric wires, cables,
connectors, electric wire processors, AWM, wire harness processors, and electric
wire or cable measuring instrument, and related books, etc.
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전시회명 |
동경 실장 프로세스 테크놀로지
박람회
(JISSO PROTEC
2023) |
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개최기간 |
2023
년 5 월 31 일 ~ 6 월 2 일 |
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전시장소 |
Big Sight |
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주
최 |
Japan Robot Association (JARA) |
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개최규모 |
약 507
Exhibitors (2019년
기준)
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참관객수 |
약 44,110
여명 참가 (2019년 기준)
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전시품목 |
- Electronic Component Placement Machines and related Equipment and Systems
Electronic component placement machines, electronic component insertion machines, screen printers, soldering equipment (reflow oven), and dispensers
- Packaging related Equipment and Systems
Transfer systems, taping machines and materials, bulk feeders and other feeders, and automatic assembly machines
- Semiconductor Packaging Machines and Systems
Wire bonders, die bonders, flip chip packaging systems, LCD/COG bonding systems, BGA/ILB systems, and COB systems
- Inspection/Test Equipment
Automated optical inspection equipment, inspection/measuring equipment associated with semiconductor manufacturing, and inspection/measuring equipment associated with other packaging
- Packaging Design Systems
Design tools, production optimizing software, and packaging programming devices
- Packaging Devices/Components and related Materials
SMD, semiconductor package parts, small electronic parts, chip parts, connectors, sockets, switches, and bulk supplies
- Packaging Device Packaging Materials
Taping reels, carrier tape, TAB tape/reel, magazine sticks, IC trays, and bulk cases
- Packaging Joining Systems
Soldering devices, solder/joining materials, and underfill materials
- High Frequency Compatible Devices, Components, and Materials
Devices, components, and materials
- Environment related Devices and Materials
Devices and materials associated with the zero emission process and waste treatment recovery
- Publications
Related books in every field
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전시회명 |
동경 최첨단 전자 기술
박람회
(Microelectronics Show) |
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개최기간 |
2023
년 5 월 31 일 ~ 6 월 2 일 |
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전시장소 |
Big Sight |
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주
최 |
Japan Institute of Electronics Packaging (JIEP) |
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개최규모 |
약 507
Exhibitors (2019년
기준)
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참관객수 |
약 44,110
여명 참가 (2019년 기준)
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전시품목 |
- Leading-edge products based on high-density or high-frequency packaging
technologies, high-density substrate and interposers, component contained
boards, semiconductor chips, systems in package (SiP), systems on chip (SoC),
indication/optical devices and sensors, materials related to high-density
packaging, pastes, lead-free solder and junction materials, sealing resins,
adhesives,, and underfill materials, anti-heat materials, high frequency ready
polymer, systems and devices related to high-density packaging such as bonders
(e.g. wire bonders, die bonders, and LCD/COG bonders), dispensers, flip chip
(FC) packaging, BGA/CSP assembly, TAB packaging, OLB/ILB systems, and COB
systems and equipment and production facilities, and related books,
etc.
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전시회명 |
동경 전자회로산업 박람회
(JPCA SHOW)
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개최기간 |
2023
년 5 월 31 일 ~ 6 월 2 일 |
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전시장소 |
Big Sight |
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주
최 |
Japan Electronics Packaging and Circuits Association (JPCA) |
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개최규모 |
약 507
Exhibitors (2019년
기준)
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참관객수 |
약 44,110
여명 참가 (2019년 기준)
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전시품목 |
[PWB
Tech (프린트 배선판 기술 전시회)]
- Products
Single-sided, double-sided, and multi-layered printed wiring boards, flexible
printed wiring boards, build-up wiring boards, flex-rigid printed wiring boards,
ceramic wiring boards, metal (copper, aluminum, etc.) based printed wiring
boards, other printed wiring boards, and related books, etc.
- Design Technologies
Functional design (circuit design for functional requests) technology, logical
design (circuit diagram design) technology, parts layout design and bill of
materials, pattern design, layout design, structure design, various design
support tools (for the above listed technologies), signal integrity design
support tools, power integrity design support tools, electromagnetic field
analysis (measures for EMC/EMI/SI), electrical, mechanical, and thermal property
simulators, CAE devices such as CAD, CAM, CIM, and related books, etc.
- Reliability and Inspection Technologies
Inspection and assessment contract services, various kinds of inspection
devices, various testing devices, evaluation/analysis systems, inspection jigs,
and related books, etc.
- Main Materials
Rigid copper clad laminates (CCLs), flexible copper clad laminates (FCCLs),
shield boards, multi-layer PWB prepregs, copper foil with adhesive, ceramic
board materials, copper/aluminum board materials, special board materials,
various insulating materials, solder mask materials, and related books, etc.
- Processing Technologies, Materials and Equipment
Plating, mold casting, hole drilling, plate making, plating chemicals, surface
processing chemicals, etching chemicals, various inks, pastes, various tools,
dry film resist, and related books, etc
- Manufacturing Equipment
Chemical processing device, photolithography exposure equipment, machining
equipment, transportation equipment, coating equipment, plasma processing
equipment, laser processing devices, printing equipment, and related books, etc.
- Environmental Systems
Water pollution control system, waste material and liquid processing,
global-warming prevention system, air pollution control system, land
contamination prevention system, noise control system, energy conservation
system, CO2 reduction system, heat utilization (such as heat exchangers/waste
heat utilization systems/thermal storage systems), and related books, etc.
- Distribution Systems
Transportation, packaging and packing equipment, embossed carriers, trays,
tubes, internal and external boxes, logistics system, transportation system,
trade control service, procurement and commissioned production, ordering system,
drawing and documentation control systems, security systems, inventory control
systems, traceability control, warehouse control system, intellectual property
management systems, IT solutions, and related books, etc.
[Module
Japan (반도체 패키징·부품
내장 기술 전시회)]
- Products
Rigid substrate, build-up substrate, tape substrate, COF/TAB, ceramic substrate,
lead frame, wafer-level package, two-dimensional package (SiP), three-dimension
packages, silicon interposer, glass interposer, MEMS interposer (with rewiring
layer), functional layer interposer, rigid active device embedded substrate,
flexible active device embedded substrate, rigid passive device embedded
substrate, flexible passive device embedded substrate, module device embedded
substrate, IPD device embedded substrate, MEMS device embedded substrate, LTCC,
bare dies, WLCSP/WLP, BGA (CSP), LGA, QFN, Chip parts, complex chip parts, IPD,
modules of various types, MEMS, books on related topics, and related books, etc.
- Design Technologies
Functional design (circuit design for functional requests) technology, logical
design (circuit diagram design) technology, parts layout design and bill of
materials, pattern design, layout design, structure design, various design
support tools (for the above listed technologies), signal integrity design
support tools, power integrity design support tools, electromagnetic field
analysis (measures for EMC/EMI/SI), electrical, mechanical, and thermal property
simulators, CAE devices such as CAD, CAM, CIM, and related books, etc.
- Reliability and Inspection Technologies
Inspection and assessment contract services, various kinds of inspection
devices, various testing devices, evaluation/analysis systems, inspection jigs,
and related books, etc.
- Main Materials
Core multi-layered PWBs, organic package substrate materials, various alloys
(Fe-Ni, Cu), polyimide film/tape, ceramic board materials, silicon wafers, glass
blanks, organic/inorganic rewiring layer and materials, metal plates/radiator
plates, metal stiffener plates, semiconductor insulating layer materials,
optical wave guide materials, solder mask materials, organic/inorganic board
(insulating) materials, copper foil carriers, film carriers, and related books,
etc.
- Processing Technologies, Materials and Equipment
Plating, mold casting, hole drilling, plate making, plating chemicals, surface
processing chemicals, etching chemicals, various inks, pastes, various tools,
dry film resist, die bonding materials, bonding wire, solder balls, bump
materials, metal barrier materials, sealing resin, underfill, coating materials,
various adhesives agents, conductive/nonconductive film,
conductive/nonconductive paste, metal masks, and related books, etc.
- Manufacturing Equipment
Chemical processing device, photolithography exposure equipment, machining
equipment, transportation equipment, coating equipment, cleaning equipment,
back-grinding equipment, CMP equipment, dicing equipment, wire bonders, die
bonders, flip chip bonder, dispenser, plasma processing equipment, laser
drilling equipment, RIE (Reactive Ion Etching) equipment, laser marking
equipment, laser trimming machine, thermosetting device, printing equipment, and
related books, etc.
- Environmental Systems
Water pollution control system, waste material and liquid processing,
global-warming prevention system, air pollution control system, land
contamination prevention system, noise control system, energy conservation
system, CO2 reduction system, heat utilization (including heat exchangers/waste
heat utilization systems/thermal storage systems) and related books, etc.
- Distribution Systems
Transportation, packaging and packing equipment, embossed carriers, trays,
tubes, internal and external boxes, logistics system, transportation system,
trade control service, procurement and commissioned production, ordering system,
drawing and documentation control systems, security systems, inventory control
systems, traceability control, warehouse control system, intellectual property
management systems, IT solutions, and related books, etc.
[EMS
Japan(기기·반도체 수탁생산
시스템 전시회)]
- Products
Printed wiring mount board (printed wiring board on which electronic components
are mounted and electrically interconnected; eg., AV or digital home appliances,
mobile devices, automobiles, PCs and PC peripherals, household appliances and
industrial equipment, and motherboards for powered devices), mounted module
substrate (a module substrate on which electronic components are mounted and
electrically interconnected; eg., AV and digital home appliances, mobile
devices, automobile, PCs and PC peripherals, household appliances and industrial
equipment, and module boards and IC packages for powered devices), insertion
device mounted board, chip component mounted board, IC package mounted board,
wire bonding mounted board, TAB/COF mounted board, flip chip mounted board,
other electronic circuit boards, memory and storage devices, general-purpose
logic ICs, transistors, diodes, optical semiconductors, sensor/imagining
elements, high-frequency devices, microcomputers, ASIC, specific-purpose ICs
(for use in TVs, AV equipment, communications equipment, in-car devices, and
peripherals), general-purpose linear ICs (power supply ICs, motor drivers, LED
drivers, transistor arrays, operational amplifiers and comparators, intelligent
power devices (IPD), etc.), and related books, etc.
- Design Technologies
Packaging and structural design technologies, functional design technologies,
logical design technologies, part layout design technologies, bill of materials
(BOM), pattern design, layout design, various design support tools, 2D CAD, 3D
CAD, digital mock-up tools, knowledge management systems, plotters/printers,
CAM, process simulators, CAE (mechanism analysis, structure analysis,
thermo-fluid analysis, resin flow analysis, casting analysis, electromagnetic
field analysis, press analysis), analyzing service by contract, and related
books, etc.
- Reliability and Inspection Technologies
Electronic circuit mounted board/ semiconductor integrated circuit inspection
and assessment contract services, various kinds of electronic circuit mounted
board and semiconductor integrated circuit inspection devices, various kinds of
electronic circuit mounted board and semiconductor integrated circuit testing
devices, various kinds of electronic circuit mounted board and semiconductor
integrated circuit evaluation and analysis systems, burn-in devices, logical
testing devices, memory test devices, linear testing systems, inspection jigs,
testing, inspection and assessment contract services, and related books, etc.
- Main Materials
Electronic circuit boards, module substrates, wafers, mask materials, solder,
lead frames, molding compounds, packaging materials, product structural
components, other main materials used in the manufacture of electronic circuit
mounted boards, development services by consignment, and related books, etc
- Manufacturing Equipment, and Processing Materials and Equipment
Processing equipment and materials such as agents, chemicals, pastes, films,
jigs and tools for manufacturing printed wiring mounted boards (including for
processes such as mounting, embedding, insertion and assembly of parts and
devices), processing equipment and materials such as agents, chemicals, pastes,
films, jigs and tools for manufacturing mounted module substrates (for processes
such as die layering and stacking, embedding and assembly, dicing, bonding,
packaging, sealing, marking, soldering and other mounting and assembly
processes), processing equipment and materials such as agents, chemicals,
pastes, films, jigs and tools for manufacturing semiconductor integrated
circuits (for processes such as single-crystal processing/exposure,
depiction/resist processing/etching/heat treatment/ thin film formation/ion
implantation/ washing and drying, etc.), various types of machine tools for
device production, casting, defining/washing equipment, various transportation
systems and equipment, pure water/ liquid agent/water treatment equipment,
various types of gas devices, clean rooms, control equipment, FA systems, and
related books, etc.
- Environmental Systems
Water pollution control system, waste material and liquid processing,
global-warming prevention system, air pollution control system, land
contamination prevention system, noise control system, energy conservation
system, CO2 reduction system, heat utilization (including heat exchangers/waste
heat utilization systems/thermal storage systems) and related books, etc.
- Distribution Systems
Transportation, packaging and packing equipment, embossed carriers, trays,
tubes, internal and external boxes, logistics system, transportation system,
trade control service, procurement and commissioned production, ordering system,
drawing and documentation control systems, security systems, inventory control
systems, traceability control, warehouse control system, intellectual property
management systems, IT solutions, and related books, etc.
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전시회명 |
동경 SDGS 박람회(SDGS) |
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개최기간 |
2023
년 5 월 31 일 ~ 6 월 2 일 |
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전시장소 |
Big Sight |
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전시품목 |
- Renewable
energy related electronics
- Power
electronics related mounting. materials. Power Semiconductors.
Power devices(IGBTs. MOSFETs. Bipolar transistor).
various memories(S-RAM. D-RAM). Semiconductor package.
module with built-in parts. metal core printed wiring
board. thermal solution. Solar cell batteries. batteries.
hydrogen fuel. power electronics. various related
devices
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B팀
(1급호텔)
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IMAGING
JAPAN
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ARIAKE
WASHINGTON
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포함내역 |
왕복항공료. 특급/1급호텔 (2인
1실 기준). 1억원 여행자 보험. 일정상 식사. 인천공항
이용료(17,000원). 출국납부금(10,000원). 현지공항세. 전용차량비. 가이드 경비.
★유류할증료
★ 현지 가이드 및 기사TIP ★
전시장
입장등록
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불포함 |
A팀]
전시장내의 중식
[1안~2안
B팀]전시장내의
중식. 6/1 차량+가이드+석식 불포함 |
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이용호텔 |
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 [A팀] SHINAGAWA
PRINCE HOTEL (특급호텔; 시내중심
위치)
4개의
대형건물. 총3,680개 객실.
11개의 멀티플렉스극장.
13개의 레스토랑. IMAX영화시설. 대형수족관.
볼링센터. 실내수영장. 실외수영장. 테니스코트
등의 부대시설.
시나가와역 다카나와
출구 도보2분 거리
객실내
고속인터넷 무료이용 가능
ADD ; 10-30 Takanawa
4-chome, Minato-ku, Tokyo, 108-8611
TEL ; +81-3-3440-1111
FAX ; +81-3-3441-7092
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[B팀] TOKYO
BAY ARIAKE WASHINGTON HOTEL (1급호텔)
아리아케역 도보
3분 거리, 전시장 도보 5분 거리
ADD ; 3-7-11, Ariake, Koto-Ku, Tokyo, Japan
TEL ; (03)5564-0111
FAX ; (03)5564-0525
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신청방법 |
아래의
참관신청서를
작성후 icetour@icetour.co.kr
로 신청하여 주십시오.
-신청금은 아래계좌로 입금하여 주시고, 잔액은 출발 1주일 전까지 완불하여 주시면
됩니다
하나은행 374-810031-68904 예금주 : (주)국제박람회여행사
[취소] 각 안 인보이스
참조
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신청서 양식 |
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신청마감 |
각 안별 선착순 20명 또는 출발 2주일전 마감 |
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최저
행사인원 |
10명
최저 행사 인원이 안될 경우 엑스포텔(EXPOTEL) 상품으로 진행합니다.
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상담 및 문의 |
Tel:
02-585-1009 Fax: 02-585-1102
심재철 대표. 김소정 실장
(icetour@icetour.co.kr) |
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기타 사항 |
단체 행사 (10인 이상), 기업연수, 업체 방문
수배, 개별 출장 등 문의 하여 주시면 최고의 컨설팅으로 최상의 일정을 준비하여 드리겠습니다. |
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제1안 대한항공(KE)
;
[A팀-시내중심
특급호텔]
전시
2일참관+시내관광
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인천
동경
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KE703
전용차 |
08:10
10:10
12:35
오후
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인천공항 2터미널 만남의 장소 집결
인천 출발
동경
도착
동경 화상 외 동시개최전시 참관
석식
후
호텔 CHECK-IN |
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동경 |
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호텔 조식
후
동경 화상 외 동시개최전시 참관
석식 후 호텔 투숙
*6/1
석식+가이드+차량 포함
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제3일
6/2
(금)
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동경
인천 |
전용차
KE704
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13:55
16:30
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호텔 조식
후 CHECK-OUT
간단한 시내관광
동경 출발
인천
도착 |
호텔식
기내식
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▶ [A팀호텔]
SHINAWA PRINCE HOTEL-동경시내 특급호텔. 전일정 차량이용
▶ 상담 및 문의 : (주)국제박람회여행사 TEL:02-585-1009
상기
일정은 항공편 및 현지사정에 의하여 변경될 수 있습니다
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[B팀-전시장
도보5분 1급호텔] 전시
2일참관+시내관광
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인천
동경
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KE703
전용차 |
08:10
10:10
12:35
오후
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인천공항 2터미널
만남의 장소 집결
인천 출발
동경
도착
동경 화상 외 동시개최전시 참관
석식
후
호텔 CHECK-IN |
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동경 |
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호텔 조식
후
동경 화상 외 동시개최전시 참관
호텔 투숙
*6/1
석식+가이드+차량 불포함
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제3일
6/2
(금)
|
동경
인천 |
전용차
KE704
|
13:55
16:30
|
호텔 조식
후 CHECK-OUT
간단한 시내관광
동경 출발
인천
도착 |
호텔식
기내식
|
|
▶ [B팀호텔]TOKYO BAY
ARIAKE WASHINGTON HOTEL-전시장 도보 5분거리
▶ 상담 및 문의 : (주)국제박람회여행사 TEL:02-585-1009
상기
일정은 항공편 및 현지사정에 의하여 변경될 수 있습니다
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제2안 아시아나(OZ)
;
[A팀-시내중심
특급호텔]
전시 2일참관+시내관광
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인천
동경
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OZ102
전용차 |
07:00
09:00
11:20
오후
|
인천공항
1터미널 만남의 장소 집결
인천 출발
동경 도착
동경 화상 외 동시개최전시 참관
석식
후
호텔 CHECK-IN |
|
|
|
동경 |
|
|
호텔 조식
후
동경 화상 외 동시개최전시 참관
석식 후 호텔 투숙
*6/1
석식+가이드+차량 포함
|
|
|
제3일
6/2
(금)
|
동경
인천 |
|
13:20
15:50
|
호텔 조식
후 CHECK-OUT
간단한 시내관광
동경 출발
인천 도착
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▶ [A팀호텔]
SHINAGAWA PRINCE HOTEL-동경시내 특급호텔. 전일정 차량이용
▶ 상담 및 문의 : (주)국제박람회여행사 TEL:02-585-1009
상기
일정은 항공편 및 현지사정에 의하여 변경될 수 있습니다
|
[B팀-전시장
도보5분 1급호텔] 전시
2일참관+시내관광
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인천
동경
|
OZ102
전용차 |
07:00
09:00
11:20
오후
|
인천공항
1터미널 만남의 장소 집결
인천 출발
동경 도착
동경 화상 외 동시개최전시 참관
석식
후
호텔 CHECK-IN |
|
|
|
동경 |
도보
|
|
호텔 조식
후
동경 화상 외 동시개최전시 참관
호텔 투숙
*6/1
석식+가이드+차량 불포함
|
|
|
제3일
6/2
(금)
|
동경
인천 |
전용차
OZ101
|
13:20
15:50
|
호텔 조식
후 CHECK-OUT
간단한 시내관광
동경 출발
인천 도착
|
호텔식
기내식
|
|
▶ [B팀호텔]TOKYO BAY
ARIAKE WASHINGTON HOTEL-전시장 도보 5분거리
▶ 상담 및 문의 : (주)국제박람회여행사 TEL:02-585-1009
상기
일정은 항공편 및 현지사정에 의하여 변경될 수 있습니다
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