동경 loT 지원반도체 및 회로기판 박람회
(TOTAL Organic Devices Expo 2020)
1.
전시회명 :
동경 IoT 지원반도체 및 회로기판 박람회
(TOTAL
Organic Devices Expo 2020)
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Total
Organic Devices Expo 2020
(동경
IoT 지원반도체 및 회로기판 박람회)
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JPCA
SHOW
2020
(동경
전자회로산업 박람회)
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Microelectronics Show 2020
(동경
최첨단 전자
기술 박람회)
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Jisso
PROTEC 2020
(동경
실장
프로세스 테크놀러지 박람회)
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WIRE
Japan Show 2020
(동경
와이어
및 케이블 박람회)
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Smart
Sensing 2020
(동경
스마트센싱 박람회)
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JEP/TEP
SHOW 2020
(동경
반도체 전자부품 박람회)
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전시회명 |
동경 IoT
지원 반도체 및 회로 기판 박람회
(Total Organic
Devices Expo) |
|
개최기간 |
2020
년 5 월 27 일 ~ 5 월 29 일 |
|
전시장소 |
Big Sight |
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주
최 |
Japan Electronics Packaging and Circuits Association(JPCA)
http://www.jpcashow.com/show2020/en/ |
|
개최규모 |
약 507
Exhibitors (2019년
기준)
|
|
참관객수 |
약 44,110
여명 참가 (2019년 기준)
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전시품목 |
- Applications of Printed Electronics
Printed electronics substrate (rigid and flexible), display products (organic TFT, organic/inorganic EL, LCD, electronic papers, wearable displays, 3D displays, POP displays, etc.), next-generation lighting, AC EL lighting, light control film, electrophoresis, chemical compound solar cells, die sensitization solar cells, organic film solar cells, fuel cells, capacitors, flexible speakers, flexible actuators, antenna modules, RFID, printed memory, printed tags, smart labels, organic devices, light circuit/light communication devices, electromagnetic wave shielding film, ceramic capacitors, thin-film transistors, organic transistors, sensor modules, and related books, etc.
- Main Printed Electronics Materials
Conductive materials, semiconductor materials, dielectric materials, insulating materials, metal nano-particles, oxide semiconductors, flexible sheets, and related books, etc.
- Process Materials
Conductive ink, insulating ink, ink-jet ink, metal colloid, organic EL, color filters, orientation panels, encapsulation materials, barrier materials, transparent conductive film, functional film, light-curing materials, photoelectric conversion materials, photocatalysts, polymer semiconductor materials, and related books, etc.
- Design Technologies
Various design simulations, molecular design software, design tools, analysis tools, ultra-high-precision measurement machine design tools, and related books, etc.
- Reliability and Inspection Technologies
Surface defect inspection device, layer thickness measurement devices, film defect inspection device, contact angle measurement device, various electronic microscopes, transmittance measurement device, uneven layer thickness analysis device, organic EL brightness assessment system, phase difference measurement device, polarization measurement device, brightness measurement device, illuminance measurement device, chromaticity measurement device, retardation measurement device, spectroscopic ellipsometer, spectral interference layer thickness measurement device, and related books, etc.
- Manufacturing Equipment
Ink-jet printing devices, nano-imprint devices, micro contact printing, dispenser, laser abrasion, laser transcription, gravure printing (including gravure offset printing), screen printing (including rotary screen printing), flexographic printing, transfer printing, Roll to Roll pattern forming, photo lithography, fine pattern exposure device, coating, drying, curing, and burning devices (ultraviolet ray, electron beam, far-infrared ray), heat laminate device, surface processing device, and related books, etc.
- Parts, MEMS and Devices
MOS logic/micro/memory semiconductors, digital bipolar semiconductors, system LSI, analog IC, photo IC, power IC, discrete semiconductor or other semiconductors, memory devices, passive devices (resistors, capacitors, transformers, coils, inductors, oscillatory parts, filters), noise prevention devices, connection parts (connectors, switches, relays), conversion parts (acoustic parts, magnetic heads, ultra-small motors, sensors), functional parts, photo MEMS (mirrors, switches, scanners, etc.), RF-MEMS (switches, oscillatory devices, filters, etc.), sensor MEMS (acceleration, angularity, velocity, pressure, gas, temperature, etc.), fluid MEMS (micro flow channels, micro reactors, etc.), actuator MEMS (valves, pumps, etc.), power MEMS (fuel cells, compact generators), bio/chemical MEMS (DNA/RNA chips, chemical substance inspection, etc.), integrated MEMS (CMOS/LSI integrated devices, etc.)
- Parts, MEMS and Device Materials
Semiconductor Silicon, chemical compound semiconductor materials, organic semiconductor materials, magnetic materials (ferrite), dielectric materials, electronic parts materials, electronic parts metal materials, permanent magnets, bond magnets, piezoelectric ceramics, quartz materials, non-lead piezoelectric materials, liquid phase method materials, electrode materials, piezoelectric film (ZnO, AIN, PZT), sapphire, polymers, LTCC substrates, glass substrates, Si, and related books, etc.
- Process Materials and Equipment
Film-forming and wiring materials, film-forming materials for CVD and ALD, CVD materials and gasses, ion injection gas, photo masks, liquid immersion lithography materials, photo resist materials, etching fluid and gas, CMP polishing materials, various detergents, various synthetic materials, various additives, surface-active agents, various solvents, tape or pasting materials, adhesives, protection materials, nanotubes, film materials for MEMS (e.g. getter materials), polymer materials such as dendrimer, polymer materials, sterile clothes/gloves/masks/shoes/caps, clean rollers/wipers/various rolls/brushes, static charge free products/dust-free products, clean room/clean bench/isolators, films/mats/sheets, particle counters, air conditioners, filters, other cleaning-related tools, and related books, etc.
- Design Technologies
Hardware design solutions (system LSI, ASIC/ASSP, MPU/DSP, FPGA/PLD devices, EDA), function design, logic design, layout design, structure design, signal integrity design support tools, power integrity design support tools, electromagnetic field analysis tools (for EMC/EMI), electrical, mechanical, and thermal property simulators, CAE support equipment such as CAD, CAM, CIM, and related books, etc.
- Reliability and Inspection Technologies
Inspection consignment services, burn-in device, logic test equipment, memory test equipment, linear test system, various inspection devices, various test devices, waveform measurement devices, transmission characteristic instruments, wireless communication measurement devices, semiconductor/IC measurement devices, industrial measurement devices, evaluation/analysis systems, inspection jigs, and related books, etc.
- Manufacturing Equipment
Wafer processing equipment, single crystal production device, exposure/depiction device, resist processing equipment, etching equipment, dry etching device, heat processing device, thin film forming device (CVD devices, sputtering devices, etc.), ion injection device, CMP equipment, cleaning-drying equipment, various transportation systems and equipment, pure water/chemical liquid/water processing equipment, various gas devices, dicing equipment, micro/nano dies, nano imprint device, ion beam processing equipment, micro radiation processing equipment, sheet forming equipment, extrusion/casting/injection molding machine, pressurized forming equipment, laser micro processing equipment, thin film coating equipment, drying furnaces, burning/sintering equipment, microwave heating equipment, dissolution process equipment, fracturing process equipment, ultrasound processing equipment, wafer bonding equipment (aligner), deep etching equipment (for MEMS), clean room equipment, and related books, etc.
- LED/OLED Applications
High luminance LED, organic EL, electronic circuit boards for mounting power IC/IGBT/inverters and other high power devices, or electronic circuit boards already mounted with the above, LED/OLED (Organic EL) lighting devices, lighting modules/units, various types of display devices, display backlight units, in-car units, LED/organic EL lighting implements and devices, LED/OLED lighting control systems, power supply, driver IC controllers, and related books, etc.
- LED/OLED Main Materials
Crystal substrates, electrode materials, glass substrates, resist materials, phosphor, ceramic materials, organic EL materials, lead frames, and related books, etc.
- Processing Materials and Equipment
Bonding wires, molding materials, binding/sealing materials and pastes, resins, heat sinks, heat-release/heat-resistance materials, coating materials, solder, masks, desiccant, reflective material, lenses, metal mold, polarizer, light reflector, optical film, and related books, etc.
- Design Technologies
Optical design tools, thermo-fluid analysis tools, structural analysis tools, CAE/CAD/CAM and other design support tools, PLM/CPC/PDM, and related books, etc.
- Reliability and Inspection Technologies
Appearance inspection system/surface inspection system, LED/OLED measuring instrument, luminance measuring instrument, thermal resistance measuring instrument, color measuring instrument, illuminance measuring instrument, spectroscopic/photometric measuring instrument, current/voltage measuring instrument, acceleration/life testing machine, and other inspection/measurement/test/evaluation related instruments, and related books, etc.
- Manufacturing Equipment
Coating equipment, resist processing equipment, exposure device, etching equipment, bonder, joining machine, molding/sealing-process-related equipment, cleaning equipment, carrier device, clean-related equipment, anti-electrostatic equipment, water processor, gas/chemical supplying device, lighting module, unit assembly equipment, mounted device, and related books, etc.
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전시회명 |
동경 전자회로산업 박람회
(JPCA SHOW)
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|
개최기간 |
2020
년 5 월 27 일 ~ 5 월 29 일 |
|
전시장소 |
Big Sight |
|
주
최 |
Japan Electronics Packaging and Circuits Association (JPCA)
http://www.jpcashow.com/show2020/en/
|
|
개최규모 |
약 507
Exhibitors (2019년
기준)
|
|
참관객수 |
약 44,110
여명 참가 (2019년 기준)
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전시품목 |
[PWB
Tech (프린트 배선판 기술 전시회)]
- Products: Single-sided, double-sided, and multi-layered printed wiring boards, flexible
printed wiring boards, build-up wiring boards, flex-rigid printed wiring boards,
ceramic wiring boards, metal (copper, aluminum, etc.) based printed wiring
boards, other printed wiring boards, and related books, etc.
- Design Technologies:Functional design (circuit design for functional requests) technology, logical
design (circuit diagram design) technology, parts layout design and bill of
materials, pattern design, layout design, structure design, various design
support tools (for the above listed technologies), signal integrity design
support tools, power integrity design support tools, electromagnetic field
analysis (measures for EMC/EMI/SI), electrical, mechanical, and thermal property
simulators, CAE devices such as CAD, CAM, CIM, and related books, etc.
- Reliability and Inspection Technologies:
Inspection and assessment contract services, various kinds of inspection
devices, various testing devices, evaluation/analysis systems, inspection jigs,
and related books, etc.
- Main Materials: Rigid copper clad laminates (CCLs), flexible copper clad laminates (FCCLs),
shield boards, multi-layer PWB prepregs, copper foil with adhesive, ceramic
board materials, copper/aluminum board materials, special board materials,
various insulating materials, solder mask materials, and related books, etc.
- Processing Technologies, Materials and Equipment:
Plating, mold casting, hole drilling, plate making, plating chemicals, surface
processing chemicals, etching chemicals, various inks, pastes, various tools,
dry film resist, and related books, etc
- Manufacturing Equipment:
Chemical processing device, photolithography exposure equipment, machining
equipment, transportation equipment, coating equipment, plasma processing
equipment, laser processing devices, printing equipment, and related books, etc.
- Environmental Systems:
Water pollution control system, waste material and liquid processing,
global-warming prevention system, air pollution control system, land
contamination prevention system, noise control system, energy conservation
system, CO2 reduction system, heat utilization (such as heat exchangers/waste
heat utilization systems/thermal storage systems), and related books, etc.
- Distribution Systems:
Transportation, packaging and packing equipment, embossed carriers, trays,
tubes, internal and external boxes, logistics system, transportation system,
trade control service, procurement and commissioned production, ordering system,
drawing and documentation control systems, security systems, inventory control
systems, traceability control, warehouse control system, intellectual property
management systems, IT solutions, and related books, etc.
[Module
Japan (반도체 패키징·부품
내장 기술 전시회)]
- Products: Rigid substrate, build-up substrate, tape substrate, COF/TAB, ceramic substrate,
lead frame, wafer-level package, two-dimensional package (SiP), three-dimension
packages, silicon interposer, glass interposer, MEMS interposer (with rewiring
layer), functional layer interposer, rigid active device embedded substrate,
flexible active device embedded substrate, rigid passive device embedded
substrate, flexible passive device embedded substrate, module device embedded
substrate, IPD device embedded substrate, MEMS device embedded substrate, LTCC,
bare dies, WLCSP/WLP, BGA (CSP), LGA, QFN, Chip parts, complex chip parts, IPD,
modules of various types, MEMS, books on related topics, and related books, etc.
- Design Technologies: Functional design (circuit design for functional requests) technology, logical
design (circuit diagram design) technology, parts layout design and bill of
materials, pattern design, layout design, structure design, various design
support tools (for the above listed technologies), signal integrity design
support tools, power integrity design support tools, electromagnetic field
analysis (measures for EMC/EMI/SI), electrical, mechanical, and thermal property
simulators, CAE devices such as CAD, CAM, CIM, and related books, etc.
- Reliability and Inspection Technologies:
Inspection and assessment contract services, various kinds of inspection
devices, various testing devices, evaluation/analysis systems, inspection jigs,
and related books, etc.
- Main Materials: Core multi-layered PWBs, organic package substrate materials, various alloys
(Fe-Ni, Cu), polyimide film/tape, ceramic board materials, silicon wafers, glass
blanks, organic/inorganic rewiring layer and materials, metal plates/radiator
plates, metal stiffener plates, semiconductor insulating layer materials,
optical wave guide materials, solder mask materials, organic/inorganic board
(insulating) materials, copper foil carriers, film carriers, and related books,
etc.
- Processing Technologies, Materials and Equipment:
Plating, mold casting, hole drilling, plate making, plating chemicals, surface
processing chemicals, etching chemicals, various inks, pastes, various tools,
dry film resist, die bonding materials, bonding wire, solder balls, bump
materials, metal barrier materials, sealing resin, underfill, coating materials,
various adhesives agents, conductive/nonconductive film,
conductive/nonconductive paste, metal masks, and related books, etc.
- Manufacturing Equipment: Chemical processing device, photolithography exposure equipment, machining
equipment, transportation equipment, coating equipment, cleaning equipment,
back-grinding equipment, CMP equipment, dicing equipment, wire bonders, die
bonders, flip chip bonder, dispenser, plasma processing equipment, laser
drilling equipment, RIE (Reactive Ion Etching) equipment, laser marking
equipment, laser trimming machine, thermosetting device, printing equipment, and
related books, etc.
- Environmental Systems: Water pollution control system, waste material and liquid processing,
global-warming prevention system, air pollution control system, land
contamination prevention system, noise control system, energy conservation
system, CO2 reduction system, heat utilization (including heat exchangers/waste
heat utilization systems/thermal storage systems) and related books, etc.
- Distribution Systems: Transportation, packaging and packing equipment, embossed carriers, trays,
tubes, internal and external boxes, logistics system, transportation system,
trade control service, procurement and commissioned production, ordering system,
drawing and documentation control systems, security systems, inventory control
systems, traceability control, warehouse control system, intellectual property
management systems, IT solutions, and related books, etc.
[EMS
Japan(기기·반도체 수탁생산
시스템 전시회)]
- Products: Printed wiring mount board (printed wiring board on which electronic components
are mounted and electrically interconnected; eg., AV or digital home appliances,
mobile devices, automobiles, PCs and PC peripherals, household appliances and
industrial equipment, and motherboards for powered devices), mounted module
substrate (a module substrate on which electronic components are mounted and
electrically interconnected; eg., AV and digital home appliances, mobile
devices, automobile, PCs and PC peripherals, household appliances and industrial
equipment, and module boards and IC packages for powered devices), insertion
device mounted board, chip component mounted board, IC package mounted board,
wire bonding mounted board, TAB/COF mounted board, flip chip mounted board,
other electronic circuit boards, memory and storage devices, general-purpose
logic ICs, transistors, diodes, optical semiconductors, sensor/imagining
elements, high-frequency devices, microcomputers, ASIC, specific-purpose ICs
(for use in TVs, AV equipment, communications equipment, in-car devices, and
peripherals), general-purpose linear ICs (power supply ICs, motor drivers, LED
drivers, transistor arrays, operational amplifiers and comparators, intelligent
power devices (IPD), etc.), and related books, etc.
- Design Technologies: Packaging and structural design technologies, functional design technologies,
logical design technologies, part layout design technologies, bill of materials
(BOM), pattern design, layout design, various design support tools, 2D CAD, 3D
CAD, digital mock-up tools, knowledge management systems, plotters/printers,
CAM, process simulators, CAE (mechanism analysis, structure analysis,
thermo-fluid analysis, resin flow analysis, casting analysis, electromagnetic
field analysis, press analysis), analyzing service by contract, and related
books, etc.
- Reliability and Inspection Technologies:
Electronic circuit mounted board/ semiconductor integrated circuit inspection
and assessment contract services, various kinds of electronic circuit mounted
board and semiconductor integrated circuit inspection devices, various kinds of
electronic circuit mounted board and semiconductor integrated circuit testing
devices, various kinds of electronic circuit mounted board and semiconductor
integrated circuit evaluation and analysis systems, burn-in devices, logical
testing devices, memory test devices, linear testing systems, inspection jigs,
testing, inspection and assessment contract services, and related books, etc.
- Main Materials: Electronic circuit boards, module substrates, wafers, mask materials, solder,
lead frames, molding compounds, packaging materials, product structural
components, other main materials used in the manufacture of electronic circuit
mounted boards, development services by consignment, and related books, etc
- Manufacturing Equipment, and Processing Materials and Equipment:
Processing equipment and materials such as agents, chemicals, pastes, films,
jigs and tools for manufacturing printed wiring mounted boards (including for
processes such as mounting, embedding, insertion and assembly of parts and
devices), processing equipment and materials such as agents, chemicals, pastes,
films, jigs and tools for manufacturing mounted module substrates (for processes
such as die layering and stacking, embedding and assembly, dicing, bonding,
packaging, sealing, marking, soldering and other mounting and assembly
processes), processing equipment and materials such as agents, chemicals,
pastes, films, jigs and tools for manufacturing semiconductor integrated
circuits (for processes such as single-crystal processing/exposure,
depiction/resist processing/etching/heat treatment/ thin film formation/ion
implantation/ washing and drying, etc.), various types of machine tools for
device production, casting, defining/washing equipment, various transportation
systems and equipment, pure water/ liquid agent/water treatment equipment,
various types of gas devices, clean rooms, control equipment, FA systems, and
related books, etc.
- Environmental Systems: Water pollution control system, waste material and liquid processing,
global-warming prevention system, air pollution control system, land
contamination prevention system, noise control system, energy conservation
system, CO2 reduction system, heat utilization (including heat exchangers/waste
heat utilization systems/thermal storage systems) and related books, etc.
- Distribution Systems: Transportation, packaging and packing equipment, embossed carriers, trays,
tubes, internal and external boxes, logistics system, transportation system,
trade control service, procurement and commissioned production, ordering system,
drawing and documentation control systems, security systems, inventory control
systems, traceability control, warehouse control system, intellectual property
management systems, IT solutions, and related books, etc.
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전시회명 |
동경 최첨단 전자 기술
박람회
(Microelectronics Show) |
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개최기간 |
2020
년 5 월 27 일 ~ 5 월 29 일 |
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전시장소 |
Big Sight |
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주
최 |
Japan Institute of Electronics Packaging (JIEP)
http://www.jpcashow.com/show2020/en/ |
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개최규모 |
약 507
Exhibitors (2019년
기준)
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참관객수 |
약 44,110
여명 참가 (2019년 기준)
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전시품목 |
- Leading-edge products based on high-density or high-frequency packaging
technologies, high-density substrate and interposers, component contained
boards, semiconductor chips, systems in package (SiP), systems on chip (SoC),
indication/optical devices and sensors, materials related to high-density
packaging, pastes, lead-free solder and junction materials, sealing resins,
adhesives,, and underfill materials, anti-heat materials, high frequency ready
polymer, systems and devices related to high-density packaging such as bonders
(e.g. wire bonders, die bonders, and LCD/COG bonders), dispensers, flip chip
(FC) packaging, BGA/CSP assembly, TAB packaging, OLB/ILB systems, and COB
systems and equipment and production facilities, and related books,
etc.
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전시회명 |
동경 실장 프로세스 테크놀로지
박람회
(JISSO PROTEC) |
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개최기간 |
2020
년 5 월 27 일 ~ 5 월 29 일 |
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전시장소 |
Big Sight |
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주
최 |
Japan Robot Association (JARA)
http://www.jpcashow.com/show2020/en/ |
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개최규모 |
약 507
Exhibitors (2019년
기준)
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참관객수 |
약 44,110
여명 참가 (2019년 기준)
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전시품목 |
- Electronic Component Placement Machines and related Equipment and Systems
Electronic component placement machines, electronic component insertion machines, screen printers, soldering equipment (reflow oven), and dispensers
- Packaging related Equipment and Systems
Transfer systems, taping machines and materials, bulk feeders and other feeders, and automatic assembly machines
- Semiconductor Packaging Machines and Systems
Wire bonders, die bonders, flip chip packaging systems, LCD/COG bonding systems, BGA/ILB systems, and COB systems
- Inspection/Test Equipment
Automated optical inspection equipment, inspection/measuring equipment associated with semiconductor manufacturing, and inspection/measuring equipment associated with other packaging
- Packaging Design Systems
Design tools, production optimizing software, and packaging programming devices
- Packaging Devices/Components and related Materials
SMD, semiconductor package parts, small electronic parts, chip parts, connectors, sockets, switches, and bulk supplies
- Packaging Device Packaging Materials
Taping reels, carrier tape, TAB tape/reel, magazine sticks, IC trays, and bulk cases
- Packaging Joining Systems
Soldering devices, solder/joining materials, and underfill materials
- High Frequency Compatible Devices, Components, and Materials
Devices, components, and materials
- Environment related Devices and Materials
Devices and materials associated with the zero emission process and waste treatment recovery
- Publications
Related books in every field
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전시회명 |
동경
와이어 및 케이블 박람회 (WIRE Japan Show)
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개최기간 |
2020
년 5 월 27 일 ~ 5 월 29 일 |
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전시장소 |
Big Sight |
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주
최 |
Japan Electronics Packaging and Circuits Association(JPCA)
http://www.jpcashow.com/show2020/en/
|
|
개최규모 |
약 507
Exhibitors (2019년
기준)
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|
참관객수 |
약 44,110
여명 참가 (2019년 기준)
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전시품목 |
- Industrial equipment and communications, such as electric wires, cables,
connectors, electric wire processors, AWM, wire harness processors, and electric
wire or cable measuring instrument, and related books, etc.
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전시회명 |
동경 스마트센싱
박람회
(Smart
Sensing) |
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개최기간 |
2020
년 5 월 27 일 ~ 5 월 29 일 |
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전시장소 |
Big Sight |
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주
최 |
JTB Communication Design, Inc.
http://www.jpcashow.com/show2020/en/ |
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개최규모 |
약 507
Exhibitors (2019년
기준)
|
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참관객수 |
약 44,110
여명 참가 (2019년 기준)
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전시품목 |
- Sensors, Sensor Nodes, Semiconductors, Parts and Devices, Electronics, Telecommunications Devices, Network Systems, Software, Data Platform, Power Sources, Other Related Devices,Technologies and Services
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전시회명 |
동경 반도체
전자부품 박람회
(JEP/TEP
SHOW) |
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개최기간 |
2020
년 5 월 27 일 ~ 5 월 29 일 |
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전시장소 |
Big Sight |
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주
최 |
Japan Federation of Electronic Parts Distributors And Dealers
Tokyo Electronics Appliances Wholesalers Association
http://www.jpcashow.com/show2020/en/ |
|
개최규모 |
약 507
Exhibitors (2019년
기준)
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참관객수 |
약 44,110
여명 참가 (2019년 기준)
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전시품목 |
- Semiconductors, Electronic Devices, Sensors, Mechanical Devices, FA control equipments, Measuring instruments, Power Sources, IoT and M2M Solution
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B팀
(1급호텔)
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TOKYO
DOME
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ARIAKE
WASHINGTON
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포함내역 |
왕복항공료. 특급/1급호텔 (2인
1실 기준). 1억원 여행자 보험. 일정상 식사. 인천공항
이용료(17,000원). 출국납부금(10,000원). 현지공항세. 전용차량비. 가이드 경비.
★유류할증료
★ 현지 가이드 및 기사TIP ★
전시장
입장등록
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불포함
내역 |
전시장내의 중식 |
|
이용호텔 |
|
 [A팀] TOKYO DOME HOTEL (특급호텔; 시내중심
위치)
총
43층 규모, 1,006개 객실.
천연온천
라쿠아,도쿄돔 시티 놀이공원
중심으로한 "도쿄돔 시티"에
위치
호텔 주변 도보거리(1분~6분)에
전철역(스이도바시,카스,코라쿠엔역)이
위치, 편리한 대중교통 이용 가능
전객실
무료 VDSL 고속인터넷 회선
이용가능
ADD ; 1-3-61 Koraku,Bunkyo-ku,Tokyo 112-8562
TEL ; +81-3-5805-2111
FAX
; +81-3-5805-2200
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[B팀] TOKYO
BAY ARIAKE WASHINGTON HOTEL (1급호텔)
아리아케역 도보
3분 거리, 전시장 도보 5분 거리
ADD ; 3-7-11, Ariake, Koto-Ku, Tokyo, Japan
TEL ; (03)5564-0111
FAX ; (03)5564-0525
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신청방법 |
아래의
참관신청서를
작성후 팩스 (FAX :02-585-1102) 또는 온라인으로 신청하여 주십시오.
1. 온라인 예약은 회원등록 후 신청하실 수 있습니다
2. 신청금 300,000원은 아래계좌로 입금하여 주시고, 잔액은 출발 1주일 전
까지 완불하여 주시면
됩니다
하나은행 374-810031-68904 예금주 : (주)국제박람회여행사
[취소] 각 안 인보이스
참조
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신청서 양식 |
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신청마감 |
각 안별 선착순 20명 또는 출발 2주일전 마감 |
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최저
행사인원 |
10명
최저 행사 인원이 안될 경우 엑스포텔(EXPOTEL) 상품으로 진행합니다.
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상담 및 문의 |
Tel:
02-585-1009 Fax: 02-585-1102
심재철 대표. 김소정 실장
(icetour@icetour.co.kr) |
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기타 사항 |
단체 행사 (10인 이상), 기업연수, 업체 방문
수배, 개별 출장 등 문의 하여 주시면 최고의 컨설팅으로 최상의 일정을 준비하여 드리겠습니다. |
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제1안 대한항공(KE)
;
[A팀-시내중심
특급호텔]
전시
2일참관+시내관광
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인천
동경
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KE703
전용차 |
08:10
10:10
12:35
오후
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인천공항 2터미널
H카운터 옆 만남의 장소 집결
인천 출발
동경
도착
동경 전자회로산업 외 동시개최 박람회 참관
석식
후
호텔 CHECK-IN |
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동경 |
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호텔 조식
후
동경 전자회로산업 외 동시개최 박람회 참관
석식 후 호텔 투숙
*5/28
석식+가이드+차량 포함
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제3일
5/29
(금)
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동경
인천 |
전용차
KE704
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13:55
16:30
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호텔 조식
후 CHECK-OUT
간단한 시내관광
동경 출발
인천
도착 |
호텔식
기내식
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▶ [A팀호텔]TOKYO DOME HOTEL-동경시내 특급호텔. 전일정 차량이용
▶ 상담 및 문의 : (주)국제박람회여행사 TEL:02-585-1009, FAX:02-6442-0319
상기
일정은 항공편 및 현지사정에 의하여 변경될 수 있습니다
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[B팀-전시장
도보5분 1급호텔] 전시
2일참관+시내관광
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인천
동경
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KE703
전용차 |
08:10
10:10
12:35
오후
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인천공항 2터미널
H카운터 옆 만남의 장소 집결
인천 출발
동경
도착
동경 전자회로산업 외 동시개최 박람회 참관
석식
후
호텔 CHECK-IN |
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동경 |
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호텔 조식
후
동경 전자회로산업 외 동시개최 박람회 참관
호텔 투숙
*5/28
석식+가이드+차량 불포함
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제3일
5/29
(금)
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동경
인천 |
전용차
KE704
|
13:55
16:30
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호텔 조식
후 CHECK-OUT
간단한 시내관광
동경 출발
인천
도착 |
호텔식
기내식
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▶ [B팀호텔]TOKYO BAY
ARIAKE WASHINGTON HOTEL-전시장 도보 5분거리
▶ 상담 및 문의 : (주)국제박람회여행사 TEL:02-585-1009, FAX:02-6442-0319
상기
일정은 항공편 및 현지사정에 의하여 변경될 수 있습니다
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제2안 아시아나(OZ)
;
[A팀-시내중심
특급호텔]
전시 2일참관+시내관광
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인천
동경
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OZ102
전용차 |
07:00
09:00
11:20
오후
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인천공항
1터미널 A카운터 옆 만남의 장소 집결
인천 출발
동경 도착
동경 전자회로산업 외 동시개최 박람회
참관
석식
후
호텔 CHECK-IN |
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동경 |
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호텔 조식
후
동경 전자회로산업 외 동시개최 박람회 참관
석식 후 호텔 투숙
*5/28
석식+가이드+차량 포함
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제3일
5/29
(금)
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동경
인천 |
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13:20
15:50
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호텔 조식
후 CHECK-OUT
간단한 시내관광
동경 출발
인천 도착
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▶ [A팀호텔]TOKYO DOME HOTEL-동경시내 특급호텔. 전일정 차량이용
▶ 상담 및 문의 : (주)국제박람회여행사 TEL:02-585-1009, FAX:02-6442-0319
상기
일정은 항공편 및 현지사정에 의하여 변경될 수 있습니다
|
[B팀-전시장
도보5분 1급호텔] 전시
2일참관+시내관광
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인천
동경
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OZ102
전용차 |
07:00
09:00
11:20
오후
|
인천공항
1터미널 A카운터 옆 만남의 장소 집결
인천 출발
동경 도착
동경 전자회로산업 외 동시개최 박람회
참관
석식
후
호텔 CHECK-IN |
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동경 |
도보
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호텔 조식
후
동경 전자회로산업 외 동시개최 박람회 참관
호텔 투숙
*5/28
석식+가이드+차량 불포함
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제3일
5/29
(금)
|
동경
인천 |
전용차
OZ101
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13:20
15:50
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호텔 조식
후 CHECK-OUT
간단한 시내관광
동경 출발
인천 도착
|
호텔식
기내식
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▶ [B팀호텔]TOKYO BAY
ARIAKE WASHINGTON HOTEL-전시장 도보 5분거리
▶ 상담 및 문의 : (주)국제박람회여행사 TEL:02-585-1009, FAX:02-6442-0319
상기
일정은 항공편 및 현지사정에 의하여 변경될 수 있습니다
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