5월 추천 박람회

뉴렌버그 동력기술 박람회
전기. 전자. 반도체

뉴렌버그 동력기술 박람회 (PCIM EUROPE 2025)

2025-05-06 ~ 2025-05-08

박람회 안내

전시회명 뉴렌버그 동력기술 박람회
개최기간 2025년 5월 6일 ~ 2025년 5월 8일
전시장소 Nuremberg Exhibition Center
주최 Mesago Messe Frankfurt GmbH
개최규모 약 637 Exhibitors(2024년 기준)
참관객수 약 18,102여명 참가(2024년 기준)
홈페이지
전시품목
  • POWER SEMICONDUCTORS, POWER COMPONENTS, POWER MODULES AND DISCRETES

Bipolar Transistors. Diodes. Rectifiers. Solid State Relais. IGBTs. Integrated Power Modules(IPMs). Power Modules. Discrete Devices. MOSFETs. Power System in Packange(PSiP). Thyristors. GTOs. IGCTs. Schottky Diodes. Wide Band-Gap Semiconductors(Sic. GaN. GaAs)

  • INTEGRATED CIRCUITS

Linear ICs. Digital ICs. Coreless Transformer. Levelshifter. Application Oriented ICs(ASICs. FPGA's). Microcontrollers. MCU's. Digital Signal Processors(DSPs). Power ICs. GaN Power IC. LED Lighting Drives. Opto Semiconductor. Fiber Optics. Power Factor Correction ICs. High Voltage ICs(HV-ICs). Motion Control ICs. Communication ICs. Voltage Regulators. Gate Drivers.

  • PASSIVE COMPONENTS

Integrated Passives. Capacitors. Supercapacitors. Electrolyte Capacitors. Foil Capacitors. Ceramic Capacitors. Chokes. Air Coils. Ferrite. EMI Filters. Power Resistors. Fuses. Current Transformers. Power Transformers. Signal Transformers. Varistors.

  • MAGNETIC MATERIALS AND COIL MATERIALS

Magnetic Cores. Core Materials. Amorphous Magnetic Cores. Ferroelectric Ceramic Products. HF-Materials. Nanocrystalline Magnetic Cores. Permanent-Magnet Products. Powder Cores. Tape Wound Cores. SiFe Laminates. Coil Bobbins. Soft-Magnetics Products. Enamelled Copper Wire. Litz Wires.

  • THERMAL MANAGEMENT

Heat Pipes. Ceramic Substrates. Heat Sinks. Base Plate. Lead Frame. Solder Material(Ag/Cu). Chip Gel. Peltier Elements. Phase Change Materials/Cooling. Thermal Filler Materials. Thermal Compounds. Thermal Shieldings. Thermal Insulators. Thermal Switches. Thermostats. Thermal Interface Materials. Heat Exchangers. Wafer Cooling Systems. Thermistors(NTCs. PTCs. PPTCs). Fans

  • SENSORS

Magnetic Field Sensors. Voltage Sensors. Current Sensors. Temperature Sensors. Radiation Sensors.

  • ASSEMBLIES AND SUBSYSTEMS

Interconnection Technologies. EMC Shielding. EMC Filters. EMC Protection. ESD Protection. Housing Technolgoies. Cables. Shielded Cables. Mounting Materials. Motor Protection Relays. Mains Filter Modules. Switches. Circuit Breakers. DC Breaker. Sockets. Connectors. Bus Bars

  • POWER CONVERTERS

DC/DC Converter. Wireless Power Transfer. Solid-State Transformers. Frequency Converters. Rectifiers/PFC Rectifiers. High-Voltage Power Supplies. Electric Vehicles(EV) Chargers. Multilevel Converters. Multi-Phase Converters. Power Electronic Stacks. Programmable Power Supplies. Switched Mode Power Supplies(SMPS), System Power Supplies. AC Power Supplies. Power Converters for E-Mobility. Power Converters for Photovolatic. Power Converters for Railway. Power Converters for Windpower. Backup Power Systems. Uninterrruptable Power Supply. Auxiliary Power Supply

  • POWER QUALITY

Active, single-phase main filters. Active, three-phase main filters. Passive, single-phase main filters. Passive, three-phase main filters. Lightning Protection. Mains Power Stabilizers. Voltage Stabilizers. Power Factor Correction Systems. DC-Grids. Micro-Grids

  • ENERGY STORAGE

Energy Storage Systems. Battery Storag Systems. Smart Battery Management Systems. Battery Testers. Simulation Tools for Battery Systems. Power Manangement Systems

  • TEST EQUIPMENT and MEASUREMENT EQUIPMENT

Current Meters. Voltage Meters. Voltage Probes. Current Probes. Multimeters. Resistance Meters. Waveform Generators. Electronic Loads. EMC and EMI Measurement ans Test Equipment. Specialized Laboratory Test Equipment. Laboratory Power Supplies. Power Analysers/Power Meters. Powerline Measurement Equipment. Oscilloscopes. Peak Current Generator. Power Cycling Testing. Wire Bonding. Later Cutting. 3D-Printer. Surge-current testing. 3D-Microscophy. Humidty-Test. Failure Aanlysis Test Equipment. Plasma Cleaning. Equipment for distructive and non-distructive Testing. Environmental Testing

  • DEVELOPMENT TOOLS AND TEST TOOLS

Design and Development Software. Tools for Design Automation. Motor Design and Prototyping. Tools for Motor Design. Prototyping. Digital Twin. Evaluation and Demonstration Boards. Development and Testsystems(Hardware. Software. Hardware in the Loop). Software Tools for Test Systems. Simulation Software. Software for Special Applliations. Test Software

  • INFORMATION AND SERVICES

Training. Technical Consulting Services. Technical Publishing Houses. Power Electronic Organisations and Networks

박람회 참관 일정표

[제1그룹]
제1안 ~ 제2안
  • 제1안 05-05 ~ 05-09

    아시아나(OZ) ; 박람회 3일 참관 (기차이동)

    일정표 보기
  • 제2안 05-05 ~ 05-09

    독일항공(LH) ; 박람회 2일 참관 (항공이동) ; 아시아나 마일리지 적립가능

    일정표 보기

박람회 참관안내

포함 아이콘 포함내역

[엑스포텔 상품] 왕복항공+호텔(2인1실기준)+여행자보험+박람회입장권

왕복항공료. 1급 호텔 (2인1실 기준). 2억원 여행자 보험. 호텔 조식. 인천공항 이용료. 출국납부금. 현지공항세

★ 유류할증료 ★ 전시입장료 (사전등록시 87유로, VAT 19%별도)

아이콘 불포함내역

전시장내의 중식 및 석식. 전용 차량 및 가이드

아이콘 입국안내
여권의 유효기간이 6개월 이상 남아있어야 합니다.
아이콘 호텔안내

▶HOLIDAY INN EXPRESS FÜRTH (1급 호텔)

호텔이미지
호텔이미지
호텔이미지
호텔이미지


2023년 1분기 신축 오픈

뉴렌버그 공항까지 차로 23분거리

Stadthalle U-Bahn 역까지 걸어서 4분 거리

전시장까지 U-Bahn 이동시 30분 소요 (직행 - 19개 정류장)

무료 WiFi 사용가능



ADD : Rosenstr 44, Fuerth, 90762

TEL : 49-911-8170590

참관 신청 방법

신청 방법

  • 1. 신청서 양식을 작성 후 이메일(icetour@icetour.co.kr)로 신청하여 주시기 바랍니다.
  • 2. 온라인 예약은 회원가입 후 신청하실 수 있습니다.
  • 3. 신청금은 아래계좌로 입금하여 주시고, 잔액은 출발 일주일 전까지 완불하여 주시기 바랍니다.
KEB하나은행

하나은행 : 374-810031-68904 /
예금주 : (주)국제박람회여행사

신청마감

- 각 안별 선착순 20명 또는 출발 2주일전 마감

최저 행사인원

- 10명(최저 행사 인원이 안될 경우 엑스포텔[EXPOTEL] 상품으로 진행합니다.)

상담 및 문의

안아림 팀장

  • Tel : 02-585-1009
  • e-mail : aran@icetour.co.kr

이소은 사원

  • Tel : 02-585-1009
  • e-mail : selee@icetour.co.kr

김소정 실장

  • Tel : 02-585-0039
  • e-mail : icetour@icetour.co.kr
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