5월 추천 박람회
박람회 안내
| 전시회명 | 뉴렌버그 전자어셈블리 및 시스템용 솔루션 박람회 (행사종료) |
|---|---|
| 개최기간 | 2025년 5월 6일 ~ 2025년 5월 8일 |
| 전시장소 | Nuremberg Exhibition Center |
| 주최 | Mesago Messe Frankfurt GmbH |
| 개최규모 | 약 227 Exhibitors |
| 참관객수 | 약 8,387여명 참가 |
| 홈페이지 | |
| 전시품목 |
** 뉴렌버그 SMT CONNECT 박람회는 2024년 기준 박람회가 종료되어, 더이상 개최되지 않습니다. ** 자동삽입기,CAE,화학원료,전자패키징,반도체생산,하이브드리드회로,인쇄회로기판(PCB),PCB생산,납땜장치,측량기,측정기술,표면실장기술(SMT),테스팅장비,스크린프린팅,이음기술,공구류 [SYSTEM DEVELOPMENT AND PRODUCTION PREPARATION]
(1) CIRCUIT CONTRACT DEVELOPMENT ASIC design. PCB assembly design/hardware design. Software design. Designs. Circuit optimization. Design of Hybride circuits (2) FUNCTIONAL TEST Electrical simulation service. Thermal simulation service. Thermo-mechanical simulation service (3) AUDITS ESD Audit
(1) INCOMING GOODS INSPECTION Light microscopes. Magnifier lamps (2) MARKING AND LABELING EQUIPMENT Labels. Label printer. Label application. Laser marking. Barcode solutions. RFID solutions (3) COMPONENT LOADING Component preparation equipment. Inertia belt reel. Heat sealing machines. Magazining units. Carrier/blister tapes
(1) DESIGN System design tools. Layout systems. Placing systems. CAD/CAM software. CAE/CAD tools. Components library (2) SIMULATION Electrical simulation tools, Thermal simulation tools, Thermo- mechanical simulation tools, Logic simulators, ASIC simulators (3) PROGRAMMING Programming tools, In-Circuit programmers (4) TEST Test pattern generators
(1) CONSULTING AND TRAINING (2) TREND ANALYSIS (3) PUBLISHERS
(1) LOGIC COMPONENTS (2) MIXED SIGNAL COMPONENTS (3) POWER COMPONENTS (4) PASSIVE COMPONENTS Capacitors. Coils. Resistors. Quartz Oscillators. Fuses. Resonators (5) SWITCHES AND RELAYS Relays. Switches. Code switches. Other switches (6) FILM CIRCUITS Thickfilm devices. Thinfilm devices. Hybrid modules (7) INTERCONNECTION DEVICES Plugs. Sockets. Connectors. Contact elements, Coupler (8) CABLE ASSEMBLY Insulation stripping tools and machines. Crimping machines. Cable assembly machines. Cable harness sheating machines. Cable marking systems (9) CABLE HARDNESS ASSEMBLY Cable confection service. Cable hardness sheating service. Cable marking systems. Crimp services (10) LED AND DISPLAYS Display systems. LC Displays and modules. Plasma displays. Touch screen systems. Other displays (11) BATTERIES AND HOLDERS (12) Key boards and input devices (13) Dummy components (14) Housing Enclosures for electronics. Sensor packages. Housing for microsystems. Thermal management packages. Hybrid housing. Ceramic packagings. Metal top cover. Ball grid arrays. PAL. PLD. FPGA. Pin-Grid arrays
Thermal interface materials. Cooler. Fan / Ventilator. Other components
(1) CERAMIC CIRCUIT CARRIERS Ceramic substrates and circuits. LTCC tape materials and circuits. Direct bonded copper substrates (2) FR4 circuit carriers Resins. Laminates. Single and multilayer substrates. PCB with embedded components. Thick copper PCB. Heatsink PCB (3) FLEXIBLE CIRCUIT CARRIERS (4) 3D CIRCUIT CARRIERS 3D MID (5) CIRCUIT CARRIER FOR SPECIAL PURPOSES High temperature circuit carriers. High frequency circuit carriers. High current circuit carriers. High Density Interconnect Circuit Carriers. Optical/electro-optical circuit boards (6) OTHER SUBSTRATES Alumnium circuit carriers. IMS substrates. Copper laminated metal substrates. Photo-sensitive substrates
Hardness measurement devices. Viscosimeter. Microscope. Humidity. Wetting. Electrical resistance
(1) PRINTING - TEMPLATE AND SCREEN PRINT Template and screen printers. Templates and screens. Sweegees. Screen and template print equipment. Screen and Soldering frame cleaner. Self-mounting systems. Thick film inks. Soldering pastes. Adhesives - DISPENSING AND MIXING Dispensing machines. Dispensing accessories - ENCAPSULANTS Globtop materials. Potting materials. Underfiller - CONFORMAL COATING Conformal coating systems. Conformal coatings - JETTING Ink jetter. Paste jetter. Solderpaste jetter (2) ADHESIVE BONDING Adhesives. SMD adhesives. Conductive adhesives. Die attach adhesives (3) PLACEMENT MACHINES AND ASSEMBLY STATIONS Manual/semiautomatic SMT-insertion machines. Fully automatic SMT-insertion machines. 3D assembly equipment. Positioning systems. Special assembly stations. Assembly tools and benches (4) SOLDERING Reflow soldering systems. Vapor-phase soldering systems. Wave soldering systems. IR soldering systems. Laser soldering systems. Selective soldering systems. Special soldering systems(Pulse soldering systems. Induction soldering systems. Spot soldering systems). Soldering irons(Hot-ba soldering systems. Light-beam soldering systems. Nitrogen hand-soldering stations. Wave hand-soldering systems. Hot-air soldering systems). Soldering materials(Solders. Soldering pastes. Solder preforms. Solder wires. Solder spheres). Fluxes. Soldering auxiliary equipment(Soldering masks. Soldering frames. Solder wire feeder). Solder recovery. Solder analysis (5) HARDENING UV-Hardening. IR-Hardening. Thermal hardening. Vacuum ovens. Hotplates (6) BONDING - Die bonders - Wire bonders(Wire bonding machines. Wire bonding tools. Bond wires. Ultrasonic generators. Ultrasonic transducer systems) (7) MECHANICAL CONNECTION TECHNOLOGY Clamping. Plugging. Crimping (8) MANUAL WORKSTATIONS BGA/SMT reworksystems. PCB track control and repair stations (9) BALLING Manua/semiautomatic balling systems. Fully automatic balling systems
(1) AUTOMATION AND HANDLING EQUIPMENT Component loading equipment. Handling systems for chips. Handling and automatic feed. Machine linking and transport. Storage devices. Drives(Direct drives. Linear motors. Linear actuators). (2) CLEANROOM TECHNOLOGIES Clean room Equipment. Clean room Materials. Flow boxes (3) WORKPLACE FURNITURE Assembly benches, Magnifiers, Lamps. (4) ESD-PROTECTION Anti-static work places. ESD-clothing. ESD-packaging, storage and shipping (5) STORAGE Dry storage systems. Storage systems under nitrogen atmosphere. Vacuum storage sytems. Cooling cabinets. Heating cabinets (6) MAGAZINES AND CONTAINERS Plastic magazines and containers. Metal magazines and containers. Vacuum boxes (7) PACKAGING Carrier/blister tapes. Packaging material. Desiccants. Humidity indicator cards (8) CLEANSER stencil cleaners. PCB cleaners. Plastic cleaners (9) CLEANING AND RECYCLING SYSTEMS Plasma cleaning systems. Dry ice jet cleaner. Other cleaning devices. Waste water recycling equipment. Nobel metal recycling equipment. Filtration apparatus. Ionization devices (10) ENVIRONMENT AND OCCUPATIONAL SAFETY Solder recovery. Exhaust systems. Solder vapour extraction systems. Filters. Solder fume exhaust systems. Gas purification and flux condensing units. Fan/ventilator
(1) ELECTRONIC MANUFACTURING SERVICES (EMS) Assembly. Surface pretreatment. Plating of Substrates (2) PCB MANUFACTURING Photo plotter service (3) COMPONENTS PROVISION Taping and reeling. SMD Taping. Cutting. bending. forming. Sorting. (4) WAFER LEVEL PACKAGING Wafer thinning. Wafer level redistribution. Wafer bumping. Chip size packaging (CSP). Semiconductor interconnections. Semiconductor housing (5) CHIP ON BOARD-ASSEMBLY Chip on flex assembly. Flip chip assembly. Chip on glas assembly. (6) FILM CIRCUITS Thick film hybrids. Thin film circuits (7) LASER MACHINING Laser drilling. Laser cutting. Laser trimming (8) ENCAPSULATION Molding. Potting. Glob top. Dam & Fill. Hermetic packaging (9) ASSEMBLY INSPECTION AND TESTING Test houses. AOI Service. AXI Service. Test program development. (10) QUALITY ASSURANCE AND ANALYSIS Release testing, Reliability consulting .Failure analysis. Calibration services
(1) OPTICAL INSPECTION STATIONS Automatic optical inspection(AOI)(Solder paste AOI. Assembly AOI). Manual optical inspection(Magnifier lamps. Microscopes). PCB inspection systems. Surface measuring system(Laser profilometer. Roughness measurement systems. Flatness measurement systems). Film Thickness measuring device (2) ELECTRICAL INSPECTION Component test equipment. Probe card analyzer. probes. probe cards. PCB test equipment. Assembly test equipment. In-circuit test equipment and programs. Flying probe test equipment. Function test equipment. Insulation test equipment. EMC test equipment. High frequency measurement equipment. Hot tes for PCB and hybrids. Test programs. Other test and balance systems (3) X-RAY INSPECTION Computer tomography(CT), Automatic X-ray inspection(AXI). Manual X-ray inspection(MXI) (4) ULTRASONIC SOUND INSPECTION Transducter test systems. Acustic microscopes (5) MECHANICAL INSPECTION Bonding testers. Adhesion testers (6) CHEMICAL INSPECTION Contaminometers. Hygrometer. Oxygen analyzers. Other analytical / diagnostical equipment, (7) OTHER INSPECTION SYSTEMS Sonar test equipment. Leakage testers (8) EQUIPMENT ACCESSORIES FOR ASSEMBLY INSPECTION Test pins. Grinding machines
(1) PROCESS AND EQUIPMENT TESTING Optical displacement measurement systems. Optical amplitude measurement systems for wirebonder. Bondability tester. Adhesion testers. Screen tension measuring devices. Solderability testers. Soldering machines Control equipment. Temperature profiler, Training and testkids (2) MES-SYSTEM Production data acquisition systems. Machine data acquisition systems. |
박람회 참관 일정표
박람회 참관안내
포함내역
왕복항공료. 1급 호텔 (2인1실 기준). 2억원 여행자 보험. 호텔 조식. 인천공항 이용료. 출국납부금. 현지공항세
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불포함내역
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입국안내
여권의 유효기간이 6개월 이상 남아있어야 합니다.
호텔안내
▶HOLIDAY INN EXPRESS FÜRTH (1급 호텔)
2023년 1분기 신축 오픈
뉴렌버그 공항까지 차로 23분거리
Stadthalle U-Bahn 역까지 걸어서 4분 거리
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