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[PWB TECH] 프린트 배선판 기술 전시회
- PRODUCTS
Single-sided, double-sided, and multi-layered printed wiring boards, flexible printed wiring boards, build-up wiring boards, flex-rigid printed wiring boards, ceramic wiring boards, metal (copper, aluminum, etc.) based printed wiring boards, other printed wiring boards, and related books - DESIGN TECHNOLOGY
Functional design (circuit design for functional requests) technology, logical design (circuit diagram design) technology, Component placement design/BOM, pattern design, layout design, structural design, various design support tools, Signal integrity design support tools, Power Integrity design support tools, Electromagnetic field analysis (EMC/EMI/SI Countermeasures), Electical/mechanical/thermal characteristic simulators, CAE support equipment such as CAD.CAM/CIM - RELIABILITY AND INSPECTION TECHNOLOGY
Inspection and evaluation contract services, various inspection equipment, various test equipment, evaluation and analysis systems, inspection jigs - MAIN MATERIAL
Rigid copper clad laminates (CCLs), flexible copper clad laminates (FCCLs), shield plates, prepregs for multilayer printed wiring boards, adhesive-backed copper foil, ceramic substrate materials, copper and aluminium substrate materials, special substrate materials, vairous insulating materials, solder mask materials - PROCESS TECHNOLOGY AND EQUIPMENT
Plating process, mold manufacturing, drilling process, plate making, plating chemicals, surface treatment agents, etching chemicals, various inks, various pastes, various tools, dry film resist - MANUFACTURING EQUIPMENT
Chemical processing equipment, photo exposure equipment, machining equipment, transport equipment, coating equipment, polishing equipment, plasma processing equipment, laser processing equipment, printing equipment - ENVIRONMENTAL SYSTEMS
Water pollution prevention systems, waste and waste liquid treatment, global warming prevention systems, air pollution prevention systems, soil pollution control devices, noise prevention systems, energy saving and CO2 reduction solutions, heat utilization technologies (heat exchangers, waste heat utilization systems, heat storage systems) - LOGISTICS SYSTEMS
Conveying, packaging and packing equipment, embossed carriers, trays, tubes, internal and external boxes, logistics systems, transportation system, trade management services, procurement and contract production, ordering placement and receipt system, drawing management and documentation managementl systems, security, inventory management systems, traceability managementl, warehouse managementl system, intellectual property management systems, IT solutions
[MODULE JAPAN] 반도체 패키징 부품 내장 기술 전시회
- PRODUCTS
Rigid substrate, build-up substrate, tape substrate, COF/TAB, ceramic substrate, lead frame, wafer-level package, two-dimensional package (SiP), three-dimension packages, silicon interposer, glass interposer, MEMS interposer (with rewiring layer), functional layer interposer, rigid active device embedded substrate, flexible active device embedded substrate, rigid passive device embedded substrate, flexible passive device embedded substrate, module device embedded substrate, IPD device embedded substrate, MEMS device embedded substrate, LTCC, bare dies, WLCSP/WLP, BGA (CSP), LGA, QFN, Chip parts, complex chip parts, IPD, Various modules, MEMS, related books. - DESIGN TECHNOLOGY
Functional design (circuit design that satisfies required functionss) technology, logical design (circuit diagram creation) technology, component placement design/BOM, pattern design, layout design, structural design, various design support tools (for the above listed technologies), signal integrity design support tools, power integrity design support tools, electromagnetic field analysis (EMC/EMI/SI countermeasures), electrical, mechanical, and thermal characteristic simulators, CAE support equipment such as CAD, CAM, CIM - RELIABILITY AND INSPECTION TECHNOLOGIES
Inspection and evaluation contract services, various inspection equipment, various test equipment, evaluation and analysis systems, inspection jigs - MAIN MATERIAL
Core multilayer printed wiring boards, organic package substrate substrate materials, various alloys (Fe-Ni, Cu), polyimide film/tape, ceramic substrate materials, silicon wafers, glass blanks, organic and inorganic rewiring layer materials, metal plates/heat sinks, stiffener metal plates, semiconductor insulating layer materials, optical waveguide materials, solder mask materials, various organic and inorganic insulating materials, copper foil carriers, film carriers, and related books, etc. - PROCESS TECHNOLOGY AND EQUIPMENT
Plating process, mold manufacturing, drilling process, plate making, plating chemicals, surface treatment agents, etching chemicals, various inks, pastes, various tools, dry film resist, die bonding materials, bonding wire, solder balls, bump materials, barrier metal materials, sealing resin, underfill, coating materials, various adhesives agents, conductive and nonconductive film, conductive and nonconductive paste, metal masks. - MANUFACTURING EQUIPMENT
Chemical processing equipment, photolithography exposure equipment, machining equipment, transport equipment, coating equipment, cleaning equipment, backgrinding equipment, CMP equipment, dicing equipment, wire bonders, die bonders, flip chip bonder, dispenser, plasma processing equipment, laser drilling equipment, RIE (Reactive Ion Etching) equipment, laser marking equipment, laser trimming equipment, heat curing equipment, printing equipment - ENVIRONMENTAL SYSTEMS
Water pollution prevention system, waste material and liquid treatment, global-warming prevention system, air pollution prevention system, soil pollution control devices, noise prevention systems, energy saving and CO2 reduction solutions, heat utilization technology (heat exchangers/waste heat utilization systems/heat storage systems) - LOGISTICS SYSTEM
Conveying, packaging and warpping equipment, embossed carriers, trays, tubes, interior and exterior boxes, logistics system, transportation system, trade management service, procurement and contract production, order placement and receipt system, drawing management and document management systems, security, inventory management systems, traceability management, warehouse management system, intellectual property management systems, IT solutions.
[EMS JAPAN] 기기. 반도체 수탁생산 시스템 전시회
- PRODUCT
Printed wiring mount board (printed wiring board on which electronic components are mounted and electrically interconnected; eg., AV or digital home appliances, mobile devices, automobiles, PCs and PC peripherals, household appliances and industrial equipment, and motherboards for powered devices), mounted module substrate (a module substrate on which electronic components are mounted and electrically interconnected; eg., AV and digital home appliances, mobile devices, automobile, PCs and PC peripherals, household appliances and industrial equipment, and module boards and IC packages for powered devices), insertion device mounted board, chip component mounted board, IC package mounted board, wire bonding mounted board, TAB/COF mounted board, flip chip mounted board, other electronic circuit boards, memory and storage devices, general-purpose logic ICs, transistors, diodes, optical semiconductors, sensor/imagining elements, high-frequency devices, microcomputers, ASIC, specific-purpose ICs (for use in TVs, AV equipment, communications equipment, in-car devices, and peripherals), general-purpose linear ICs (power supply ICs, motor drivers, LED drivers, transistor arrays, operational amplifiers and comparators, intelligent power devices (IPD) - DESIGN TECHNOLOGY
Case and structural design technology, functional design technology, logical design technology, part layout design technology, bill of materials management system (BOM), pattern design, layout design, various design support tools, 2D CAD, 3D CAD, digital mock-up tools, knowledge management systems, plotters/printers, CAM, process simulators, CAE (mechanism analysis, structural analysis, thermo-fluid analysis, resin flow analysis, casting analysis, electromagnetic field analysis, press analysis) - RELIABILITY AND INSPECTION TECHNOLOGY
Electronic circuit mounted board/ semiconductor integrated circuit inspection and evaluation contract services, various electronic circuit mounted board and semiconductor integrated circuit inspection equipment, various electronic circuit mounted board and semiconductor integrated circuit test equipment, electronic circuit mounted board and semiconductor integrated circuit evaluation and analysis systems, burn-in equipment, logical test equipment, memory test equipment, linear test equipment, inspection jigs, testing, inspection and evaluation contract services. - MAIN MATERIALS
Electronic circuit boards, module boards, wafers, mask materials, solder, lead frames, molding compounds, housing materials, product components, other main materials related to the manufacture of electronic circuit mounting boards, contract development services - PROCESS TECHNOLOGY AND EQUIPMENT
Equipment and process materials for printed wiring board manufacturing , equipment and process materials for module mounting board manufacturing, equipment and process materials for semiconductor integrated circuit manufacturing, equipment and procss materials for chemicals, chemicals, pastes, films, tools, jigs and various machine tools for equipment production, molding machines, deburring/cleaning equipment, vairous transport systems and equipment, pure water/chemicals/water treatment equipment, various gas equipment, clean room equipment, control equipment/FA Systems - ENVIRONMENTAL SYSTEMS
Water pollution prevention system, waste and watse liquid treatment, global warming prevention system, air pollution preventionl system, soil pollution control devices, noise prevention systems, energy saving and CO2 reduction solutions, heat utilization technology - LOGISTICS SYSTEM
Conveying, packaging and wrapping equipment, embossed carriers, trays, tubes, interior and exterior boxes, logistics system, transportation system, trade management service, procurement and contract production, order placement, and receipt systems, drawing management and document management systems, security, inventory management systems, traceability management, warehouse management systems, intellectual property management systems, IT Solutions
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